5962-8680504XX by:

UVPROM, 64KX16, 170ns, CMOS, CQCC44, WINDOWED, CERAMIC, LLCC-44

Part Details for 5962-8680504XX by Waferscale Integration Inc

Overview of 5962-8680504XX by Waferscale Integration Inc

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Applications Education and Research Internet of Things (IoT) Industrial Automation Computing and Data Storage Aerospace and Defense Healthcare Telecommunications Electronic Manufacturing Automotive

Available Datasheets

Part # Manufacturer Description Datasheet
5962-8672601EA Rochester Electronics LLC Parity Generator/Checker, S Series, 12-Bit, Inverted Output, TTL, 0.250 X 0.875 INCH, DIP-16
5962-8672601FA Rochester Electronics LLC Parity Generator/Checker, S Series, 12-Bit, Inverted Output, TTL, 0.250 X 0.375 INCH, FP-16
5962-87518013A Rochester Electronics LLC Interrupt Controller, NMOS, CQCC28, CERAMIC, LCC-28

Part Details for 5962-8680504XX

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5962-8680504XX Part Data Attributes

5962-8680504XX Waferscale Integration Inc
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5962-8680504XX Waferscale Integration Inc UVPROM, 64KX16, 170ns, CMOS, CQCC44, WINDOWED, CERAMIC, LLCC-44
Part Life Cycle Code Obsolete
Ihs Manufacturer WAFERSCALE INTEGRATION INC
Package Description WINDOWED, CERAMIC, LLCC-44
Reach Compliance Code unknown
ECCN Code 3A001.A.2.C
HTS Code 8542.32.00.61
Access Time-Max 170 ns
I/O Type COMMON
JESD-30 Code S-CQCC-N44
Length 16.535 mm
Memory Density 1048576 bit
Memory IC Type UVPROM
Memory Width 16
Number of Functions 1
Number of Terminals 44
Number of Words 65536 words
Number of Words Code 64000
Operating Mode ASYNCHRONOUS
Operating Temperature-Max 125 °C
Operating Temperature-Min -55 °C
Organization 64KX16
Output Characteristics 3-STATE
Package Body Material CERAMIC, METAL-SEALED COFIRED
Package Code WQCCN
Package Equivalence Code LCC44,.65SQ
Package Shape SQUARE
Package Style CHIP CARRIER, WINDOW
Parallel/Serial PARALLEL
Qualification Status Not Qualified
Screening Level 38535Q/M;38534H;883B
Seated Height-Max 3.3 mm
Standby Current-Max 0.00012 A
Supply Current-Max 0.06 mA
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V
Supply Voltage-Nom (Vsup) 5 V
Surface Mount YES
Technology CMOS
Temperature Grade MILITARY
Terminal Form NO LEAD
Terminal Pitch 1.27 mm
Terminal Position QUAD
Width 16.535 mm

Alternate Parts for 5962-8680504XX

This table gives cross-reference parts and alternative options found for 5962-8680504XX. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of 5962-8680504XX, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
5962-8680504XC UVPROM, 64KX16, 170ns, CMOS, CQCC44, Atmel Corporation 5962-8680504XX vs 5962-8680504XC
5962-8680504XX UVPROM, 64KX16, 170ns, CMOS, CQCC44, AMD 5962-8680504XX vs 5962-8680504XX
AM27C1024-175LI UVPROM, 64KX16, 170ns, CMOS, CQCC44, WINDOWED, CERAMIC, LCC-44 AMD 5962-8680504XX vs AM27C1024-175LI
5962-8680504XC UVPROM, 64KX16, 170ns, CMOS, CQCC44, WINDOWED, CERAMIC, LLCC-44 Waferscale Integration Inc 5962-8680504XX vs 5962-8680504XC
5962-8680504XA UVPROM, 64KX16, 170ns, CMOS, CQCC44, WINDOWED, CERAMIC, LCC-44 AMD 5962-8680504XX vs 5962-8680504XA
5962-8680504XA UVPROM, 64KX16, 170ns, CMOS, CQCC44, Teledyne e2v 5962-8680504XX vs 5962-8680504XA
AM27C1024-175LCB UVPROM, 64KX16, 170ns, CMOS, CQCC44, WINDOWED, CERAMIC, LCC-44 AMD 5962-8680504XX vs AM27C1024-175LCB
5962-8680504XC UVPROM, 64KX16, 170ns, CMOS, CQCC44, Teledyne e2v 5962-8680504XX vs 5962-8680504XC
AM27C1024-175LIB UVPROM, 64KX16, 170ns, CMOS, CQCC44, WINDOWED, CERAMIC, LCC-44 AMD 5962-8680504XX vs AM27C1024-175LIB
5962-8680501XC UVPROM, 64KX16, 170ns, CMOS, CQCC44, CERAMIC, LCC-44 Atmel Corporation 5962-8680504XX vs 5962-8680501XC
Part Number Description Manufacturer Compare
M27V102-200F6 64KX16 UVPROM, 200ns, CDIP40, FRIT SEALED, WINDOWED, CERAMIC, DIP-40 STMicroelectronics 5962-8680504XX vs M27V102-200F6
TMS27C210A-200JE4 64KX16 UVPROM, 200ns, CDIP40, 0.600 INCH, WINDOWED, CERAMIC, DIP-40 Texas Instruments 5962-8680504XX vs TMS27C210A-200JE4
CY7B210-30WI UVPROM, 64KX16, 30ns, BICMOS, CDIP40, 0.600 INCH, WINDOWED, HERMETIC SEALED, CERDIP-40 Cypress Semiconductor 5962-8680504XX vs CY7B210-30WI
AM27C1024-155DI UVPROM, 64KX16, 150ns, CMOS, CDIP40, WINDOWED, CERAMIC, DIP-40 AMD 5962-8680504XX vs AM27C1024-155DI
AT27C1024-70DC UVPROM, 64KX16, 70ns, CMOS, CDIP40, 0.600 INCH, WINDOWED, CERDIP-40 Atmel Corporation 5962-8680504XX vs AT27C1024-70DC
AT27HC1024-70DM UVPROM, 64KX16, 70ns, CMOS, CDIP40, 0.600 INCH, WINDOWED, CERDIP-40 Atmel Corporation 5962-8680504XX vs AT27HC1024-70DM
AT27C1024-17KM/883 UVPROM, 64KX16, 170ns, CMOS, CQCC44, WINDOWED, CERAMIC, JLCC-44 Atmel Corporation 5962-8680504XX vs AT27C1024-17KM/883
M27C1024-10F6X 64KX16 UVPROM, 100ns, CDIP40, WINDOWED, FRIT SEALED, CERAMIC, DIP-40 STMicroelectronics 5962-8680504XX vs M27C1024-10F6X
M27C1024-70F6 64KX16 UVPROM, 70ns, CDIP40, WINDOWED, FRIT SEALED, CERAMIC, DIP-40 STMicroelectronics 5962-8680504XX vs M27C1024-70F6
M27C1024-90XF6X 64KX16 UVPROM, 80ns, CDIP40, WINDOWED, FRIT SEALED, CERAMIC, DIP-40 STMicroelectronics 5962-8680504XX vs M27C1024-90XF6X

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