-
Part Symbol
-
Footprint
-
3D Model
Available Download Formats
By downloading CAD models, you agree to our Terms & Conditions and Privacy Policy
Part Details for 5962-8861012ZA by Renesas Electronics Corporation
Overview of 5962-8861012ZA by Renesas Electronics Corporation
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Available)
- Number of Functional Equivalents: (0 crosses)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Space Technology
Aerospace and Defense
Transportation and Logistics
Renewable Energy
Automotive
Robotics and Drones
Part Details for 5962-8861012ZA
5962-8861012ZA CAD Models
5962-8861012ZA Part Data Attributes
|
|
5962-8861012ZA
Renesas Electronics Corporation
Buy Now
Datasheet
|
Compare Parts:
5962-8861012ZA
Renesas Electronics Corporation
2K x 16 Dual-Port RAM, PGA21/Tray
|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | RENESAS ELECTRONICS CORP | |
| Part Package Code | PGA | |
| Package Description | CAVITY-UP, CERAMIC, PGA-68 | |
| Pin Count | 68 | |
| Manufacturer Package Code | GU68 | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | 3A001A2C | |
| HTS Code | 8542320041 | |
| Samacsys Manufacturer | Renesas Electronics | |
| Access Time-Max | 55 ns | |
| I/O Type | COMMON | |
| JESD-30 Code | S-CPGA-P68 | |
| JESD-609 Code | e0 | |
| Length | 29.464 mm | |
| Memory Density | 32768 bit | |
| Memory IC Type | MULTI-PORT SRAM | |
| Memory Width | 16 | |
| Moisture Sensitivity Level | 1 | |
| Number of Functions | 1 | |
| Number of Ports | 2 | |
| Number of Terminals | 68 | |
| Number of Words | 2048 words | |
| Number of Words Code | 2000 | |
| Operating Mode | ASYNCHRONOUS | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -55 °C | |
| Organization | 2KX16 | |
| Output Characteristics | 3-STATE | |
| Output Enable | YES | |
| Package Body Material | CERAMIC, METAL-SEALED COFIRED | |
| Package Code | PGA | |
| Package Equivalence Code | PGA68,11X11 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Parallel/Serial | PARALLEL | |
| Peak Reflow Temperature (Cel) | 240 | |
| Qualification Status | Qualified | |
| Screening Level | 38535Q/M;38534H;883B | |
| Seated Height-Max | 5.207 mm | |
| Standby Current-Max | 0.03 A | |
| Standby Voltage-Min | 4.5 V | |
| Supply Current-Max | 0.315 mA | |
| Supply Voltage-Max (Vsup) | 5.5 V | |
| Supply Voltage-Min (Vsup) | 4.5 V | |
| Supply Voltage-Nom (Vsup) | 5 V | |
| Surface Mount | NO | |
| Technology | CMOS | |
| Temperature Grade | MILITARY | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | PIN/PEG | |
| Terminal Pitch | 2.54 mm | |
| Terminal Position | PERPENDICULAR | |
| Width | 29.464 mm |