5962-8866209NX by:

Standard SRAM, 32KX8, 12ns, CMOS, CDIP28, CERAMIC, DIP-28

Part Details for 5962-8866209NX by QP Semiconductor

Overview of 5962-8866209NX by QP Semiconductor

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Applications Education and Research Internet of Things (IoT) Computing and Data Storage Aerospace and Defense Healthcare Renewable Energy Telecommunications Automotive

Part Details for 5962-8866209NX

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5962-8866209NX Part Data Attributes

5962-8866209NX QP Semiconductor
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5962-8866209NX QP Semiconductor Standard SRAM, 32KX8, 12ns, CMOS, CDIP28, CERAMIC, DIP-28
Part Life Cycle Code Transferred
Ihs Manufacturer QP SEMICONDUCTOR INC
Part Package Code DIP
Package Description DIP,
Pin Count 28
Reach Compliance Code unknown
ECCN Code 3A001.A.2.C
HTS Code 8542.32.00.41
Access Time-Max 12 ns
JESD-30 Code R-GDIP-T28
Memory Density 262144 bit
Memory IC Type STANDARD SRAM
Memory Width 8
Number of Functions 1
Number of Terminals 28
Number of Words 32768 words
Number of Words Code 32000
Operating Mode ASYNCHRONOUS
Operating Temperature-Max 125 °C
Operating Temperature-Min -55 °C
Organization 32KX8
Package Body Material CERAMIC, GLASS-SEALED
Package Code DIP
Package Shape RECTANGULAR
Package Style IN-LINE
Parallel/Serial PARALLEL
Qualification Status Not Qualified
Screening Level MIL-STD-883
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V
Supply Voltage-Nom (Vsup) 5 V
Surface Mount NO
Technology CMOS
Temperature Grade MILITARY
Terminal Form THROUGH-HOLE
Terminal Position DUAL

Alternate Parts for 5962-8866209NX

This table gives cross-reference parts and alternative options found for 5962-8866209NX. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of 5962-8866209NX, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
MT5C2568C-12LE/883C Standard SRAM, 32KX8, 12ns, CMOS, CDIP28, 0.300 INCH, CERAMIC, DIP-28 Micross Components 5962-8866209NX vs MT5C2568C-12LE/883C
Part Number Description Manufacturer Compare
DPS32M8ANL-55B Standard SRAM, 32KX8, 55ns, CMOS, CDIP28, SIDE BRAZED, DIP-28 B&B Electronics Manufacturing Company 5962-8866209NX vs DPS32M8ANL-55B
DPS92256N-150M Standard SRAM, 32KX8, 150ns, CMOS, CDIP28, SIDE BRAZED, DIP-28 B&B Electronics Manufacturing Company 5962-8866209NX vs DPS92256N-150M
UT7156C-40PPA Standard SRAM, 32KX8, 40ns, CMOS, CDIP28, 0.600 X 1.400 INCH, 0.100 INCH PITCH, SIDE BRAZED, CERAMIC, DIP-28 Cobham Semiconductor Solutions 5962-8866209NX vs UT7156C-40PPA
U635H256CD1K25G1 Non-Volatile SRAM, 32KX8, 25ns, CMOS, PDIP28, 0.600 INCH, PLASTIC, DIP-28 ZMDI 5962-8866209NX vs U635H256CD1K25G1
DPS41257-120C SRAM Module, 32KX8, 120ns, CMOS B&B Electronics Manufacturing Company 5962-8866209NX vs DPS41257-120C
DPS92256-150M Standard SRAM, 32KX8, 150ns, CMOS, CDIP28, CERDIP-28 B&B Electronics Manufacturing Company 5962-8866209NX vs DPS92256-150M
DPS92256N-120I Standard SRAM, 32KX8, 120ns, CMOS, CDIP28, SIDE BRAZED, DIP-28 B&B Electronics Manufacturing Company 5962-8866209NX vs DPS92256N-120I
MMCI-65656L40SHXXX 32KX8 STANDARD SRAM, 40ns, CDIP28, 0.600 INCH, SIDE BRAZED, DIP-28 Atmel Corporation 5962-8866209NX vs MMCI-65656L40SHXXX
HM65256BLP-10 Pseudo Static RAM, 32KX8, 100ns, MOS, PDIP28, 0.600 INCH, PLASTIC, DIP-28 Hitachi Ltd 5962-8866209NX vs HM65256BLP-10
DPS41257-150I SRAM Module, 32KX8, 150ns, CMOS B&B Electronics Manufacturing Company 5962-8866209NX vs DPS41257-150I

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