Part Details for 5962-8981703XA by QP Semiconductor
Overview of 5962-8981703XA by QP Semiconductor
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (10 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Part Details for 5962-8981703XA
5962-8981703XA CAD Models
5962-8981703XA Part Data Attributes
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5962-8981703XA
QP Semiconductor
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5962-8981703XA
QP Semiconductor
UVPROM, 32KX8, 35ns, CMOS, CDIP28, 0.300 INCH, WINDOWED, CERDIP-28
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| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | QP SEMICONDUCTOR INC | |
| Part Package Code | DIP | |
| Package Description | WDIP, | |
| Pin Count | 28 | |
| Reach Compliance Code | unknown | |
| ECCN Code | 3A001.A.2.C | |
| HTS Code | 8542.32.00.61 | |
| Access Time-Max | 35 ns | |
| Additional Feature | POWER SWITCHED PROM | |
| JESD-30 Code | R-GDIP-T28 | |
| JESD-609 Code | e0 | |
| Length | 37.0205 mm | |
| Memory Density | 262144 bit | |
| Memory IC Type | UVPROM | |
| Memory Width | 8 | |
| Number of Functions | 1 | |
| Number of Terminals | 28 | |
| Number of Words | 32768 words | |
| Number of Words Code | 32000 | |
| Operating Mode | ASYNCHRONOUS | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -55 °C | |
| Organization | 32KX8 | |
| Package Body Material | CERAMIC, GLASS-SEALED | |
| Package Code | WDIP | |
| Package Shape | RECTANGULAR | |
| Package Style | IN-LINE, WINDOW | |
| Parallel/Serial | PARALLEL | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 5.08 mm | |
| Supply Voltage-Max (Vsup) | 5.5 V | |
| Supply Voltage-Min (Vsup) | 4.5 V | |
| Supply Voltage-Nom (Vsup) | 5 V | |
| Surface Mount | NO | |
| Technology | CMOS | |
| Temperature Grade | MILITARY | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | THROUGH-HOLE | |
| Terminal Pitch | 2.54 mm | |
| Terminal Position | DUAL | |
| Width | 7.62 mm |
Alternate Parts for 5962-8981703XA
This table gives cross-reference parts and alternative options found for 5962-8981703XA. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of 5962-8981703XA, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| QP7C271-35WC | UVPROM, 32KX8, 35ns, CMOS, CDIP28, 0.300 INCH, CERAMIC, WINDOWED, DIP-28 | Teledyne e2v | 5962-8981703XA vs QP7C271-35WC |
| WS57C256F-35D | UVPROM, 32KX8, 35ns, CMOS, CDIP28, 0.600 INCH, CERAMIC, DIP-28 | Teledyne e2v | 5962-8981703XA vs WS57C256F-35D |
| 5962-8606321QUA | UVPROM, 32KX8, 35ns, CMOS, CDIP28, CERAMIC, DIP-28 | Teledyne e2v | 5962-8981703XA vs 5962-8606321QUA |
| CY7C274-35WI | UVPROM, 32KX8, 35ns, CMOS, CDIP28, 0.300 INCH, WINDOWED, SLIM, CERDIP-28 | Cypress Semiconductor | 5962-8981703XA vs CY7C274-35WI |
| 5962-8981703XX | UVPROM, 32KX8, 35ns, CMOS, CDIP28, CERAMIC, DIP-28 | Teledyne e2v | 5962-8981703XA vs 5962-8981703XX |
| WS57C256F-35T | UVPROM, 32KX8, 35ns, CMOS, CDIP28, 0.300 INCH, CERAMIC, DIP-28 | Teledyne e2v | 5962-8981703XA vs WS57C256F-35T |
| CY27H256-35WI | UVPROM, 32KX8, 35ns, CMOS, CDIP28, 0.600 INCH, WINDOWED, HERMETIC SEALED, CERDIP-28 | Cypress Semiconductor | 5962-8981703XA vs CY27H256-35WI |
| 5962-8981706UX | UVPROM, 32KX8, 35ns, CMOS, CDIP28, CERAMIC, DIP-28 | QP Semiconductor | 5962-8981703XA vs 5962-8981706UX |
| 5962-8606321QXX | UVPROM, 32KX8, 35ns, CMOS, CDIP28, CERAMIC, DIP-28 | Teledyne e2v | 5962-8981703XA vs 5962-8606321QXX |
| 5962-8981706UX | UVPROM, 32KX8, 35ns, CMOS, CDIP28, CERAMIC, DIP-28 | Teledyne e2v | 5962-8981703XA vs 5962-8981706UX |