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Memory SRAMs 5962-9561312HYX

Memory
5962-9561312HYX
Description: Standard SRAM, 512KX8, 35ns, CMOS, CDIP32, CERAMIC, DIP-32

Overview of 5962-9561312HYX by Cobham Semiconductor Solutions

Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Where used in Applications: Education and Research Internet of Things (IoT) Computing and Data Storage Aerospace and Defense Healthcare Telecommunications Automotive

Available Datasheets

Part # Manufacturer Description Datasheet
5962-8672601EA Rochester Electronics LLC Parity Generator/Checker, S Series, 12-Bit, Inverted Output, TTL, 0.250 X 0.875 INCH, DIP-16
5962-8672601FA Rochester Electronics LLC Parity Generator/Checker, S Series, 12-Bit, Inverted Output, TTL, 0.250 X 0.375 INCH, FP-16
5962-87518013A Rochester Electronics LLC Interrupt Controller, NMOS, CQCC28, CERAMIC, LCC-28

CAD Models for 5962-9561312HYX by Cobham Semiconductor Solutions
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Part Data Attributes for 5962-9561312HYX by Cobham Semiconductor Solutions
Parametric Data

5962-9561312HYX
Cobham Semiconductor Solutions
Buy Now
-
-
Part Life Cycle Code
Obsolete
Ihs Manufacturer
AEROFLEX COLORADO SPRINGS
Part Package Code
DIP
Package Description
DIP,
Pin Count
32
Reach Compliance Code
unknown
ECCN Code
3A001.A.2.C
HTS Code
8542.32.00.41
Access Time-Max
35 ns
JESD-30 Code
R-CDIP-T32
Length
41.525 mm
Memory Density
4194304 bit
Memory IC Type
STANDARD SRAM
Memory Width
8
Number of Functions
1
Number of Terminals
32
Number of Words
524288 words
Number of Words Code
512000
Operating Mode
ASYNCHRONOUS
Operating Temperature-Max
125 °C
Operating Temperature-Min
-55 °C
Organization
512KX8
Package Body Material
CERAMIC, METAL-SEALED COFIRED
Package Code
DIP
Package Shape
RECTANGULAR
Package Style
IN-LINE
Parallel/Serial
PARALLEL
Qualification Status
Not Qualified
Screening Level
MIL-PRF-38534 Class H
Seated Height-Max
5.13 mm
Supply Voltage-Max (Vsup)
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
Supply Voltage-Nom (Vsup)
5 V
Surface Mount
NO
Technology
CMOS
Temperature Grade
MILITARY
Terminal Form
THROUGH-HOLE
Terminal Pitch
2.54 mm
Terminal Position
DUAL
Width
15.24 mm
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  1. 5962-9561312HYX
    Cobham Semiconductor Solutions
    Standard SRAM, 512KX8, 35ns, CMOS, CDIP32, CERAMIC, DIP-32
    VS

Alternate Parts for 5962-9561312HYX

This table gives cross-reference parts and alternative options found for 5962-9561312HYX. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of 5962-9561312HYX, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number Description Manufacturer Compare
WMS512K8-35CIA Standard SRAM, 512KX8, 35ns, CMOS, CDIP32, 0.600 INCH, SIDE BRAZED, CERAMIC, DIP-32 Mercury Systems Inc 5962-9561312HYX vs WMS512K8-35CIA
5962-9207807HTC SRAM Module, 512KX8, 35ns, CMOS, DIP-32 White Microelectronics 5962-9561312HYX vs 5962-9207807HTC
5962-9561307HYC Standard SRAM, 512KX8, 35ns, CMOS, CDIP32, CERAMIC, DIP-32 Mercury Systems Inc 5962-9561312HYX vs 5962-9561307HYC
WS512K8-35CM SRAM Module, 512KX8, 35ns, CMOS, CDMA32, 0.600 INCH, CERAMIC, DIP-32 Mercury Systems Inc 5962-9561312HYX vs WS512K8-35CM
5962-9207807HTA SRAM Module, 512KX8, 35ns, CMOS, DIP-32 Mercury Systems Inc 5962-9561312HYX vs 5962-9207807HTA
CYM1466HD-35MB SRAM Module, 512KX8, 35ns, CMOS Cypress Semiconductor 5962-9561312HYX vs CYM1466HD-35MB
5962-9561307HYC Standard SRAM, 512KX8, 35ns, CMOS, CDIP32 Cobham Advanced Electronic Solutions 5962-9561312HYX vs 5962-9561307HYC
5962-9561312HYC Standard SRAM, 512KX8, 35ns, CMOS, CDIP32, White Electronic Designs Corp 5962-9561312HYX vs 5962-9561312HYC
AS5C4008CW-35E/IT Standard SRAM, 512KX8, 35ns, CMOS, CDIP32, 0.600 INCH, CERAMIC, DIP-32 Micross Components 5962-9561312HYX vs AS5C4008CW-35E/IT
5962-9207807HXC SRAM Module, 512KX8, 35ns, CMOS, DIP-32 White Microelectronics 5962-9561312HYX vs 5962-9207807HXC
Part Number Description Manufacturer Compare
5962-9318712HTA Cache SRAM Module, 128KX32, 55ns, CMOS, HIP-66 Cobham Power Products 5962-9561312HYX vs 5962-9318712HTA
5962-8685910LA CDIP-24, Tube Integrated Device Technology Inc 5962-9561312HYX vs 5962-8685910LA
5962-9318705H5X SRAM Module, 128KX32, 55ns, CMOS, CPGA66, 1.075 X 1.075 INCH, HERMETIC SEALED, CERAMIC, HIP-66 Mercury Systems Inc 5962-9561312HYX vs 5962-9318705H5X
5962-8854504YA Standard SRAM, 64KX4, 70ns, CMOS, CDFP28, CERAMIC, FLATPACK-28 Micross Components 5962-9561312HYX vs 5962-8854504YA
P4C164-45LSI Standard SRAM, 8KX8, 45ns, CMOS, CQCC28, 0.350 X 0.550 INCH, ROHS COMPLIANT, CERAMIC, LCC-28 Pyramid Semiconductor Corporation 5962-9561312HYX vs P4C164-45LSI
MT5C2568CW-25L/XT Standard SRAM, 32KX8, 25ns, CMOS, CDIP28, 0.600 INCH, CERAMIC, DIP-28 Micross Components 5962-9561312HYX vs MT5C2568CW-25L/XT
5962-9561307HYC Cache SRAM, 512KX8, 35ns, CMOS, CDIP32, 1.600 X 0.600 INCH, 0.200 INCH HEIGHT, HERMETIC SEALED, CERAMIC, DIP-32 Cobham Power Products 5962-9561312HYX vs 5962-9561307HYC
5962-9461108HYC Cache SRAM Module, 512KX32, 25ns, CMOS, CQFP68, 1.560 X 1.560 INCH, 0.140 INCH HEIGHT, LOW PROFILE, CERAMIC, QFP-68 Cobham Power Products 5962-9561312HYX vs 5962-9461108HYC
MT5C2568CW-70L/XT Standard SRAM, 32KX8, 70ns, CMOS, CDIP28, 0.600 INCH, CERAMIC, DIP-28 Micross Components 5962-9561312HYX vs MT5C2568CW-70L/XT
5962-9461110HMC Cache SRAM Module, 512KX32, 17ns, CMOS, CQFP68, CO-FIRED CERAMIC, QFP-68 Mercury Systems Inc 5962-9561312HYX vs 5962-9461110HMC

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