Part Details for 6116LA70TDB by Integrated Device Technology Inc
Overview of 6116LA70TDB by Integrated Device Technology Inc
- Distributor Offerings: (2 listings)
- Number of FFF Equivalents: (4 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (6 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Industrial Automation
Renewable Energy
Robotics and Drones
Available Datasheets
| Part # | Manufacturer | Description | Datasheet |
|---|---|---|---|
| 6116LA70TDB | Renesas Electronics Corporation | 5.0V 2K x 8 Asynchronous Static RAM, CDIP15/Tube |
Price & Stock for 6116LA70TDB
| Part # | Distributor | Description | Stock | Price | Buy | |
|---|---|---|---|---|---|---|
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DISTI #
2156-6116LA70TDB-ND
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DigiKey | IC SRAM 16KBIT PARALLEL 24CDIP Min Qty: 16 Container: Bulk MARKETPLACE PRODUCT |
114 In Stock |
|
$18.9300 | Buy Now |
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|
Rochester Electronics | 6116 - 5.0V 2K x 8 Asynchronous Static RAM ' RoHS: Not Compliant Status: Obsolete Min Qty: 1 | 114 |
|
$16.2400 / $19.1100 | Buy Now |
Part Details for 6116LA70TDB
6116LA70TDB CAD Models
6116LA70TDB Part Data Attributes
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6116LA70TDB
Integrated Device Technology Inc
Buy Now
Datasheet
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Compare Parts:
6116LA70TDB
Integrated Device Technology Inc
CDIP-24, Tube
|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | INTEGRATED DEVICE TECHNOLOGY INC | |
| Part Package Code | CDIP | |
| Package Description | DIP-24 | |
| Pin Count | 24 | |
| Manufacturer Package Code | SD24 | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | 3A001.A.2.C | |
| HTS Code | 8542.32.00.41 | |
| Date Of Intro | 1988-01-01 | |
| Access Time-Max | 70 ns | |
| I/O Type | COMMON | |
| JESD-30 Code | R-CDIP-T24 | |
| JESD-609 Code | e0 | |
| Length | 32.004 mm | |
| Memory Density | 16384 bit | |
| Memory IC Type | STANDARD SRAM | |
| Memory Width | 8 | |
| Moisture Sensitivity Level | 1 | |
| Number of Functions | 1 | |
| Number of Terminals | 24 | |
| Number of Words | 2048 words | |
| Number of Words Code | 2000 | |
| Operating Mode | ASYNCHRONOUS | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -55 °C | |
| Organization | 2KX8 | |
| Output Characteristics | 3-STATE | |
| Package Body Material | CERAMIC, METAL-SEALED COFIRED | |
| Package Code | DIP | |
| Package Equivalence Code | DIP24,.3 | |
| Package Shape | RECTANGULAR | |
| Package Style | IN-LINE | |
| Parallel/Serial | PARALLEL | |
| Peak Reflow Temperature (Cel) | 240 | |
| Qualification Status | Not Qualified | |
| Screening Level | MIL-STD-883 Class B | |
| Seated Height-Max | 5.08 mm | |
| Standby Current-Max | 0.0003 A | |
| Standby Voltage-Min | 2 V | |
| Supply Current-Max | 0.09 mA | |
| Supply Voltage-Max (Vsup) | 5.5 V | |
| Supply Voltage-Min (Vsup) | 4.5 V | |
| Supply Voltage-Nom (Vsup) | 5 V | |
| Surface Mount | NO | |
| Technology | CMOS | |
| Temperature Grade | MILITARY | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | THROUGH-HOLE | |
| Terminal Pitch | 2.54 mm | |
| Terminal Position | DUAL | |
| Width | 7.62 mm |
Alternate Parts for 6116LA70TDB
This table gives cross-reference parts and alternative options found for 6116LA70TDB. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of 6116LA70TDB, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| 8403613LX | Standard SRAM, 2KX8, 70ns, CMOS, CDIP24, CERAMIC, DIP-24 | Integrated Device Technology Inc | 6116LA70TDB vs 8403613LX |
| IDT6116SA70TDB | Standard SRAM, 2KX8, 70ns, CMOS, CDIP24, 0.300 INCH, CERAMIC, DIP-24 | Integrated Device Technology Inc | 6116LA70TDB vs IDT6116SA70TDB |
| 8403612LA | CDIP-24, Tube | Integrated Device Technology Inc | 6116LA70TDB vs 8403612LA |
| 8403612LX | Standard SRAM, 2KX8, 70ns, CMOS, CDIP24, CERAMIC, DIP-24 | Integrated Device Technology Inc | 6116LA70TDB vs 8403612LX |