Part Details for 66AK2H12DXAAWA24 by Texas Instruments
Overview of 66AK2H12DXAAWA24 by Texas Instruments
- Distributor Offerings: (3 listings)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 crosses)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Price & Stock for 66AK2H12DXAAWA24
| Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
66AK2H12DXAAWA24-ND
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DigiKey | 66AK2H12DXAAWA24 Min Qty: 21 Lead time: 20 Weeks Container: Tray | Temporarily Out of Stock |
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$922.2457 | Buy Now |
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DISTI #
595-66AK2H12DXAAWA24
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Mouser Electronics | Digital Signal Processors & Controllers - DSP, DSC High performance multicore DSP+Arm - 4x Arm A15 cores, 8x C66x DSP cores 1517-FCBGA -40 to 100 RoHS: Compliant | 0 |
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$916.9400 | Order Now |
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Ameya Holding Limited | 88 |
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RFQ |
Part Details for 66AK2H12DXAAWA24
66AK2H12DXAAWA24 CAD Models
66AK2H12DXAAWA24 Part Data Attributes:
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66AK2H12DXAAWA24
Texas Instruments
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Datasheet
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66AK2H12DXAAWA24
Texas Instruments
High performance multicore DSP+Arm - 4x Arm A15 cores, 8x C66x DSP cores 1517-FCBGA -40 to 100
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| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | TEXAS INSTRUMENTS INC | |
| Package Description | FCBGA-1517 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 5A002.A | |
| HTS Code | 8542.31.00.01 | |
| Date Of Intro | 2017-07-27 | |
| Samacsys Manufacturer | Texas Instruments | |
| JESD-30 Code | S-PBGA-B1517 | |
| JESD-609 Code | e1 | |
| Length | 40 mm | |
| Moisture Sensitivity Level | 4 | |
| Number of Terminals | 1517 | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | -40 °C | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Peak Reflow Temperature (Cel) | 245 | |
| Seated Height-Max | 3.62 mm | |
| Supply Voltage-Max | 1.05 V | |
| Supply Voltage-Min | 0.95 V | |
| Supply Voltage-Nom | 1 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Width | 40 mm | |
| uPs/uCs/Peripheral ICs Type | SoC |