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Part Details for 66AK2E05XABD4 by Texas Instruments
Overview of 66AK2E05XABD4 by Texas Instruments
- Distributor Offerings: (3 listings)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Available)
- Number of Functional Equivalents: (0 crosses)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Price & Stock for 66AK2E05XABD4
| Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
66AK2E05XABD4-ND
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DigiKey | IC DSP ARM SOC 1089FCBGA Min Qty: 40 Lead time: 12 Weeks Container: Tray | Temporarily Out of Stock |
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$193.0323 | Buy Now |
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DISTI #
595-66AK2E05XABD4
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Mouser Electronics | Digital Signal Processors & Controllers - DSP, DSC High performance multicore DSP+Arm - 4x Arm A15 cores, 1x C66x DSP core, NetCP, 10GbE 1089-FCBGA 0 to 85 RoHS: Compliant | 0 |
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$191.1700 | Order Now |
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Ameya Holding Limited | 120 |
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RFQ |
Part Details for 66AK2E05XABD4
66AK2E05XABD4 CAD Models
66AK2E05XABD4 Part Data Attributes:
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66AK2E05XABD4
Texas Instruments
Buy Now
Datasheet
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Compare Parts:
66AK2E05XABD4
Texas Instruments
High performance multicore DSP+Arm - 4x Arm A15 cores, 1x C66x DSP core, NetCP, 10GbE 1089-FCBGA 0 to 85
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| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | TEXAS INSTRUMENTS INC | |
| Package Description | FBGA, | |
| Reach Compliance Code | compliant | |
| ECCN Code | 5A002.A | |
| Samacsys Manufacturer | Texas Instruments | |
| Address Bus Width | 16 | |
| Boundary Scan | YES | |
| External Data Bus Width | 16 | |
| Format | FLOATING POINT | |
| Integrated Cache | YES | |
| JESD-30 Code | S-PBGA-B1089 | |
| JESD-609 Code | e1 | |
| Length | 27 mm | |
| Low Power Mode | YES | |
| Moisture Sensitivity Level | 4 | |
| Number of DMA Channels | 5 | |
| Number of Terminals | 1089 | |
| On Chip Data RAM Width | 8 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | ||
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | FBGA | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, FINE PITCH | |
| Peak Reflow Temperature (Cel) | 245 | |
| RAM (words) | 2097152 | |
| Seated Height-Max | 3.55 mm | |
| Speed | 1400 MHz | |
| Supply Voltage-Max | 1.05 V | |
| Supply Voltage-Min | 0.95 V | |
| Supply Voltage-Nom | 1 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | OTHER | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Form | BALL | |
| Terminal Pitch | 0.8 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Width | 27 mm | |
| uPs/uCs/Peripheral ICs Type | MICROPROCESSOR, RISC |