There are no models available for this part yet.
Overview of 69157-170HLF by Amphenol Corporation
Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
- Distributor Offerings: ( 1 listing )
- Number of FFF Equivalents: ( 0 replacements )
- CAD Models: ( Request Part )
- Number of Functional Equivalents: ( 0 options )
- Part Data Attributes ( Not Available )
- Reference Designs: ( Not Available )
Available Datasheets
Part # | Manufacturer | Description | Datasheet |
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69157-170HLF | Amphenol Communications Solutions | BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 70 Positions, 2.54 mm (0.100in) Pitch. | |
69157-112HLF | Amphenol Communications Solutions | BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 12 Positions, 2.54 mm (0.100in) Pitch. | |
69157-136HLF | Amphenol Communications Solutions | BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 36 Positions, 2.54 mm (0.100in) Pitch. |
Price & Stock for 69157-170HLF by Amphenol Corporation
Part # | Manufacturer | Description | Stock | Price | Buy | ||
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DISTI #
69157-170HLF
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Avnet Americas | Conn Unshrouded Header HDR 70 POS 2.54mm Solder ST Thru-Hole Poly Bag - Bulk (Alt: 69157-170HLF) RoHS: Compliant Min Qty: 300 Package Multiple: 100 Container: Bulk | 0 |
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RFQ |