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256K x 36 Sync, 3.3V/2.5V Dual-Port RAM, Interleaved I/O''s, CABGA90/Tray
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
08AK8403
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Newark | Multi-Port Sram, 256Kx36, 12Ns, Cmos, Pbga256 Rohs Compliant: Yes |Renesas 70T3519S166BC Min Qty: 1 Package Multiple: 1 Date Code: 0 Container: Bulk | 0 |
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$307.2500 / $336.7100 | Buy Now |
DISTI #
70T3519S166BC-ND
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DigiKey | IC SRAM 9MBIT PARALLEL 256CABGA Min Qty: 18 Lead time: 18 Weeks Container: Tray | Limited Supply - Call |
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$269.9311 | Buy Now |
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Future Electronics | RoHS: Compliant pbFree: Yes Min Qty: 18 Package Multiple: 6 Lead time: 36 Weeks Container: Tray | 0Tray |
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$244.0700 | Buy Now |
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Future Electronics | RoHS: Compliant pbFree: Yes Min Qty: 18 Package Multiple: 6 Lead time: 36 Weeks Container: Tray | 0Tray |
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$247.2400 | Buy Now |
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Onlinecomponents.com | RoHS: Compliant |
3 Partner Stock |
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$266.8600 / $312.1800 | Buy Now |
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70T3519S166BC
Renesas Electronics Corporation
Buy Now
Datasheet
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Compare Parts:
70T3519S166BC
Renesas Electronics Corporation
256K x 36 Sync, 3.3V/2.5V Dual-Port RAM, Interleaved I/O''s, CABGA90/Tray
|
Pbfree Code | No | |
Rohs Code | No | |
Part Life Cycle Code | End Of Life | |
Ihs Manufacturer | RENESAS ELECTRONICS CORP | |
Part Package Code | CABGA | |
Pin Count | 256 | |
Manufacturer Package Code | BC256 | |
Reach Compliance Code | not_compliant | |
ECCN Code | NLR | |
HTS Code | 8542320041 | |
Samacsys Manufacturer | Renesas Electronics | |
Access Time-Max | 12 ns | |
Additional Feature | FLOW-THROUGH OR PIPELINED ARCHITECTURE | |
Clock Frequency-Max (fCLK) | 166 MHz | |
I/O Type | COMMON | |
JESD-30 Code | S-PBGA-B256 | |
JESD-609 Code | e0 | |
Length | 17 mm | |
Memory Density | 9437184 bit | |
Memory IC Type | MULTI-PORT SRAM | |
Memory Width | 36 | |
Moisture Sensitivity Level | 3 | |
Number of Functions | 1 | |
Number of Ports | 2 | |
Number of Terminals | 256 | |
Number of Words | 262144 words | |
Number of Words Code | 256000 | |
Operating Mode | SYNCHRONOUS | |
Operating Temperature-Max | 70 °C | |
Operating Temperature-Min | ||
Organization | 256KX36 | |
Output Characteristics | 3-STATE | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | LBGA | |
Package Equivalence Code | BGA256,16X16,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY, LOW PROFILE | |
Parallel/Serial | PARALLEL | |
Peak Reflow Temperature (Cel) | 225 | |
Qualification Status | Not Qualified | |
Seated Height-Max | 1.5 mm | |
Standby Current-Max | 0.015 A | |
Standby Voltage-Min | 2.4 V | |
Supply Current-Max | 0.45 mA | |
Supply Voltage-Max (Vsup) | 2.6 V | |
Supply Voltage-Min (Vsup) | 2.4 V | |
Supply Voltage-Nom (Vsup) | 2.5 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | COMMERCIAL | |
Terminal Finish | TIN LEAD | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Time@Peak Reflow Temperature-Max (s) | 20 | |
Width | 17 mm |
This table gives cross-reference parts and alternative options found for 70T3519S166BC. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of 70T3519S166BC, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Description | Manufacturer | Compare |
---|---|---|---|
IDT70T3519S166BCGI | Dual-Port SRAM, 256KX36, 12ns, CMOS, PBGA256, 17 X 17 MM, 1.40 MM HEIGHT, 1 MM PITCH, GREEN, BGA-256 | Integrated Device Technology Inc | 70T3519S166BC vs IDT70T3519S166BCGI |
70T3519S166BCI8 | CABGA-256, Reel | Integrated Device Technology Inc | 70T3519S166BC vs 70T3519S166BCI8 |
70T3519S166BC8 | CABGA-256, Reel | Integrated Device Technology Inc | 70T3519S166BC vs 70T3519S166BC8 |
70T3519S166BCI | CABGA-256, Tray | Integrated Device Technology Inc | 70T3519S166BC vs 70T3519S166BCI |
AS9C25256M2036L-166BI | Dual-Port SRAM, 256KX36, 10ns, CMOS, PBGA256, BGA-256 | Alliance Semiconductor Corporation | 70T3519S166BC vs AS9C25256M2036L-166BI |
70T3519S133BCG | Dual-Port SRAM, 256KX36, 15ns, CMOS, PBGA256, 17 X 17 MM, 1.40 MM HEIGHT, 1 MM PITCH, GREEN, BGA-256 | Integrated Device Technology Inc | 70T3519S166BC vs 70T3519S133BCG |
AS9C25256M2036L-166BC | Dual-Port SRAM, 256KX36, 10ns, CMOS, PBGA256, BGA-256 | Integrated Silicon Solution Inc | 70T3519S166BC vs AS9C25256M2036L-166BC |
70T3519S166BC8 | 256K x 36 Sync, 3.3V/2.5V Dual-Port RAM, Interleaved I/O''s, CABGA0/Reel | Renesas Electronics Corporation | 70T3519S166BC vs 70T3519S166BC8 |
70T3519S166BCGI | 256K x 36 Sync, 3.3V/2.5V Dual-Port RAM, Interleaved I/O''s, CABGA90/Tray | Renesas Electronics Corporation | 70T3519S166BC vs 70T3519S166BCGI |
70T3519S166BC | CABGA-256, Tray | Integrated Device Technology Inc | 70T3519S166BC vs 70T3519S166BC |