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Part Details for 70T3399S133BCI8 by Renesas Electronics Corporation
Overview of 70T3399S133BCI8 by Renesas Electronics Corporation
- Distributor Offerings: (2 listings)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Available)
- Number of Functional Equivalents: (0 crosses)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Consumer Electronics
Computing and Data Storage
Price & Stock for 70T3399S133BCI8
| Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
70T3399S133BCI8
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Avnet Americas | 128K x 18 Sync, 3.3V/2.5V Dual-Port RAM, Interleaved I/O's - Tape and Reel (Alt: 70T3399S133BCI8) RoHS: Not Compliant Min Qty: 1000 Package Multiple: 1000 Container: Reel | 0 |
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RFQ | |
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DISTI #
70T3399S133BCI8
|
Avnet Americas | 128K x 18 Sync, 3.3V/2.5V Dual-Port RAM, Interleaved I/O's - Tape and Reel (Alt: 70T3399S133BCI8) RoHS: Not Compliant Min Qty: 1000 Package Multiple: 1000 Container: Reel | 0 |
|
RFQ |
Part Details for 70T3399S133BCI8
70T3399S133BCI8 CAD Models
70T3399S133BCI8 Part Data Attributes:
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70T3399S133BCI8
Renesas Electronics Corporation
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Datasheet
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Compare Parts:
70T3399S133BCI8
Renesas Electronics Corporation
128K x 18 Sync, 3.3V/2.5V Dual-Port RAM, Interleaved I/O''s, CABGA0/Reel
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| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | RENESAS ELECTRONICS CORP | |
| Part Package Code | CABGA | |
| Package Description | 17 X 17 MM, 1.40 MM HEIGHT, 1 MM PITCH, BGA-256 | |
| Pin Count | 256 | |
| Manufacturer Package Code | BC256 | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | NLR | |
| HTS Code | 8542320041 | |
| Samacsys Manufacturer | Renesas Electronics | |
| Access Time-Max | 15 ns | |
| Additional Feature | FLOW-THROUGH OR PIPELINED ARCHITECTURE | |
| Clock Frequency-Max (fCLK) | 133 MHz | |
| I/O Type | COMMON | |
| JESD-30 Code | S-PBGA-B256 | |
| JESD-609 Code | e0 | |
| Length | 17 mm | |
| Memory Density | 2359296 bit | |
| Memory IC Type | MULTI-PORT SRAM | |
| Memory Width | 18 | |
| Moisture Sensitivity Level | 3 | |
| Number of Functions | 1 | |
| Number of Ports | 2 | |
| Number of Terminals | 256 | |
| Number of Words | 131072 words | |
| Number of Words Code | 128000 | |
| Operating Mode | SYNCHRONOUS | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 128KX18 | |
| Output Characteristics | 3-STATE | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Equivalence Code | BGA256,16X16,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Parallel/Serial | PARALLEL | |
| Peak Reflow Temperature (Cel) | 225 | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 1.5 mm | |
| Standby Current-Max | 0.02 A | |
| Standby Voltage-Min | 2.4 V | |
| Supply Current-Max | 0.45 mA | |
| Supply Voltage-Max (Vsup) | 2.6 V | |
| Supply Voltage-Min (Vsup) | 2.4 V | |
| Supply Voltage-Nom (Vsup) | 2.5 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 20 | |
| Width | 17 mm |