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256K x 18 Sync, 3.3V Dual-Port RAM, Pipelined/Flow-Through, Interleaved I/O''s, CABGA0/Reel
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
70V3319S166BF8-ND
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DigiKey | IC SRAM 4.5MBIT PAR 208CABGA Min Qty: 1000 Lead time: 18 Weeks Container: Tape & Reel (TR) | Limited Supply - Call |
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$188.5029 | Buy Now |
DISTI #
70V3319S166BF8
|
Avnet Americas | 256K x 18 Sync, 3.3V Dual-Port RAM, Pipelined/Flow-Through, Interleaved I/O's - Tape and Reel (Alt: 70V3319S166BF8) RoHS: Not Compliant Min Qty: 1000 Package Multiple: 1000 Lead time: 36 Weeks, 0 Days Container: Reel | 0 |
|
$185.9407 / $212.2945 | Buy Now |
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Future Electronics | RoHS: Compliant pbFree: Yes Min Qty: 1000 Package Multiple: 1000 Container: Reel | 0Reel |
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$190.1500 | Buy Now |
DISTI #
70V3319S166BF8
|
Avnet Americas | 256K x 18 Sync, 3.3V Dual-Port RAM, Pipelined/Flow-Through, Interleaved I/O's - Tape and Reel (Alt: 70V3319S166BF8) RoHS: Not Compliant Min Qty: 1000 Package Multiple: 1000 Lead time: 36 Weeks, 0 Days Container: Reel | 0 |
|
$185.9407 / $212.2945 | Buy Now |
DISTI #
70V3319S166BF8
|
Avnet Americas | 256K x 18 Sync, 3.3V Dual-Port RAM, Pipelined/Flow-Through, Interleaved I/O's - Tape and Reel (Alt: 70V3319S166BF8) RoHS: Not Compliant Min Qty: 1000 Package Multiple: 1000 Lead time: 36 Weeks, 0 Days Container: Reel | 0 |
|
$185.9407 / $212.2945 | Buy Now |
By downloading CAD models, you agree to our Terms & Conditions and Privacy Policy
|
70V3319S166BF8
Renesas Electronics Corporation
Buy Now
Datasheet
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Compare Parts:
70V3319S166BF8
Renesas Electronics Corporation
256K x 18 Sync, 3.3V Dual-Port RAM, Pipelined/Flow-Through, Interleaved I/O''s, CABGA0/Reel
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Pbfree Code | No | |
Rohs Code | No | |
Part Life Cycle Code | End Of Life | |
Ihs Manufacturer | RENESAS ELECTRONICS CORP | |
Part Package Code | CABGA | |
Pin Count | 208 | |
Manufacturer Package Code | BF208 | |
Reach Compliance Code | not_compliant | |
ECCN Code | NLR | |
HTS Code | 8542320041 | |
Factory Lead Time | 36 Weeks | |
Samacsys Manufacturer | Renesas Electronics | |
Access Time-Max | 12 ns | |
Additional Feature | PIPELINED OR FLOW-THROUGH ARCHITECTURE | |
Clock Frequency-Max (fCLK) | 166 MHz | |
I/O Type | COMMON | |
JESD-30 Code | S-PBGA-B208 | |
JESD-609 Code | e0 | |
Length | 15 mm | |
Memory Density | 4718592 bit | |
Memory IC Type | DUAL-PORT SRAM | |
Memory Width | 18 | |
Moisture Sensitivity Level | 3 | |
Number of Functions | 1 | |
Number of Ports | 2 | |
Number of Terminals | 208 | |
Number of Words | 262144 words | |
Number of Words Code | 256000 | |
Operating Mode | SYNCHRONOUS | |
Operating Temperature-Max | 70 °C | |
Operating Temperature-Min | ||
Organization | 256KX18 | |
Output Characteristics | 3-STATE | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | LFBGA | |
Package Equivalence Code | BGA208,17X17,32 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY, LOW PROFILE, FINE PITCH | |
Parallel/Serial | PARALLEL | |
Peak Reflow Temperature (Cel) | 225 | |
Qualification Status | Not Qualified | |
Seated Height-Max | 1.7 mm | |
Standby Current-Max | 0.03 A | |
Standby Voltage-Min | 3.15 V | |
Supply Current-Max | 0.5 mA | |
Supply Voltage-Max (Vsup) | 3.45 V | |
Supply Voltage-Min (Vsup) | 3.15 V | |
Supply Voltage-Nom (Vsup) | 3.3 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | COMMERCIAL | |
Terminal Finish | TIN LEAD | |
Terminal Form | BALL | |
Terminal Pitch | 0.8 mm | |
Terminal Position | BOTTOM | |
Time@Peak Reflow Temperature-Max (s) | 20 | |
Width | 15 mm |
This table gives cross-reference parts and alternative options found for 70V3319S166BF8. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of 70V3319S166BF8, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Description | Manufacturer | Compare |
---|---|---|---|
70T3319S166BF | 256K x 18 Sync, 3.3V/2.5V Dual-Port RAM, Interleaved I/O''s, CABGA126/Tray | Renesas Electronics Corporation | 70V3319S166BF8 vs 70T3319S166BF |
70T3319S166BFG8 | 256K x 18 Sync, 3.3V/2.5V Dual-Port RAM, Interleaved I/O''s, CABGA0/Reel | Renesas Electronics Corporation | 70V3319S166BF8 vs 70T3319S166BFG8 |
70T3319S166BF8 | 256K x 18 Sync, 3.3V/2.5V Dual-Port RAM, Interleaved I/O''s, CABGA0/Reel | Renesas Electronics Corporation | 70V3319S166BF8 vs 70T3319S166BF8 |
70V3319S166BFG | 256K x 18 Sync, 3.3V Dual-Port RAM, Pipelined/Flow-Through, Interleaved I/O''s, CABGA126/Tray | Renesas Electronics Corporation | 70V3319S166BF8 vs 70V3319S166BFG |
70V3319S166BFG8 | 256K x 18 Sync, 3.3V Dual-Port RAM, Pipelined/Flow-Through, Interleaved I/O''s, CABGA0/Reel | Renesas Electronics Corporation | 70V3319S166BF8 vs 70V3319S166BFG8 |