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Part Details for 70V657S10BFG8 by Renesas Electronics Corporation
Overview of 70V657S10BFG8 by Renesas Electronics Corporation
- Distributor Offerings: (4 listings)
- Number of FFF Equivalents: (8 crosses)
- CAD Models: (Available)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Education and Research
Environmental Monitoring
Internet of Things (IoT)
Industrial Automation
Computing and Data Storage
Aerospace and Defense
Healthcare
Agriculture Technology
Medical Imaging
Electronic Manufacturing
Telecommunications
Automotive
Price & Stock for 70V657S10BFG8
| Part # | Distributor | Description | Stock | Price | Buy | |
|---|---|---|---|---|---|---|
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DISTI #
70V657S10BFG8-ND
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DigiKey | IC SRAM 1.125MBIT PAR 208FPBGA Min Qty: 1000 Lead time: 18 Weeks Container: Tape & Reel (TR) | Limited Supply - Call |
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$111.5490 | Buy Now |
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DISTI #
70V657S10BFG8
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Avnet Americas | 32K x 36 3.3V Dual-Port RAM, Interleaved I/O's - Tape and Reel (Alt: 70V657S10BFG8) RoHS: Compliant Min Qty: 1000 Package Multiple: 1000 Container: Reel | 0 |
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$110.0328 / $125.6280 | Buy Now |
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Future Electronics | RoHS: Compliant pbFree: Yes Min Qty: 1000 Package Multiple: 1000 Lead time: 36 Weeks Container: Reel | 0Reel |
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$111.0800 | Buy Now |
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Future Electronics | RoHS: Compliant pbFree: Yes Min Qty: 1000 Package Multiple: 1000 Lead time: 36 Weeks Container: Reel | 0Reel |
|
$112.5200 | Buy Now |
Part Details for 70V657S10BFG8
70V657S10BFG8 CAD Models
70V657S10BFG8 Part Data Attributes
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70V657S10BFG8
Renesas Electronics Corporation
Buy Now
Datasheet
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Compare Parts:
70V657S10BFG8
Renesas Electronics Corporation
32K x 36 3.3V Dual-Port RAM, Interleaved I/O''s, CABGA0/Reel
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| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | End Of Life | |
| Ihs Manufacturer | RENESAS ELECTRONICS CORP | |
| Part Package Code | CABGA | |
| Pin Count | 208 | |
| Manufacturer Package Code | BFG208 | |
| Reach Compliance Code | compliant | |
| ECCN Code | NLR | |
| HTS Code | 8542320041 | |
| Samacsys Manufacturer | Renesas Electronics | |
| Access Time-Max | 10 ns | |
| I/O Type | COMMON | |
| JESD-30 Code | S-PBGA-B208 | |
| JESD-609 Code | e1 | |
| Length | 15 mm | |
| Memory Density | 1179648 bit | |
| Memory IC Type | MULTI-PORT SRAM | |
| Memory Width | 36 | |
| Moisture Sensitivity Level | 3 | |
| Number of Functions | 1 | |
| Number of Ports | 2 | |
| Number of Terminals | 208 | |
| Number of Words | 32768 words | |
| Number of Words Code | 32000 | |
| Operating Mode | ASYNCHRONOUS | |
| Operating Temperature-Max | 70 °C | |
| Operating Temperature-Min | ||
| Organization | 32KX36 | |
| Output Characteristics | 3-STATE | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | TFBGA | |
| Package Equivalence Code | BGA208,17X17,32 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, THIN PROFILE, FINE PITCH | |
| Parallel/Serial | PARALLEL | |
| Peak Reflow Temperature (Cel) | 260 | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 1.2 mm | |
| Standby Current-Max | 0.015 A | |
| Standby Voltage-Min | 3.15 V | |
| Supply Current-Max | 0.5 mA | |
| Supply Voltage-Max (Vsup) | 3.45 V | |
| Supply Voltage-Min (Vsup) | 3.15 V | |
| Supply Voltage-Nom (Vsup) | 3.3 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | COMMERCIAL | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Form | BALL | |
| Terminal Pitch | 0.8 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Width | 15 mm |
Alternate Parts for 70V657S10BFG8
This table gives cross-reference parts and alternative options found for 70V657S10BFG8. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of 70V657S10BFG8, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| IDT70V657S10BF8 | Dual-Port SRAM, 32KX36, 10ns, CMOS, PBGA208, 15 X 15 MM, 1.40 MM HEIGHT, 0.80 MM PITCH, FPBGA-208 | Integrated Device Technology Inc | 70V657S10BFG8 vs IDT70V657S10BF8 |
| 70V657S10BFG | 32K x 36 3.3V Dual-Port RAM, Interleaved I/O''s, CABGA126/Tray | Renesas Electronics Corporation | 70V657S10BFG8 vs 70V657S10BFG |
| 70V657S10BFG8 | CABGA-208, Reel | Integrated Device Technology Inc | 70V657S10BFG8 vs 70V657S10BFG8 |
| IDT70V657S10BFG | Dual-Port SRAM, 32KX36, 10ns, CMOS, PBGA208, 15 X 15 MM, 1.40 MM HEIGHT, 0.80 MM PITCH, GREEN, FPBGA-208 | Integrated Device Technology Inc | 70V657S10BFG8 vs IDT70V657S10BFG |
| IDT70V657S10BFG8 | Dual-Port SRAM, 32KX36, 10ns, CMOS, PBGA208, 15 X 15 MM, 1.40 MM HEIGHT, 0.80 MM PITCH, FPBGA-208 | Integrated Device Technology Inc | 70V657S10BFG8 vs IDT70V657S10BFG8 |
| 70V657S10BF | 32K x 36 3.3V Dual-Port RAM, Interleaved I/O''s, CABGA126/Tray | Renesas Electronics Corporation | 70V657S10BFG8 vs 70V657S10BF |
| IDT70V657S10BF | Dual-Port SRAM, 32KX36, 10ns, CMOS, PBGA208, 15 X 15 MM, 1.40 MM HEIGHT, 0.80 MM PITCH, FPBGA-208 | Integrated Device Technology Inc | 70V657S10BFG8 vs IDT70V657S10BF |
| 70V657S10BFG | CABGA-208, Tray | Integrated Device Technology Inc | 70V657S10BFG8 vs 70V657S10BFG |