There are no models available for this part yet.
Overview of 71256SA25P by Integrated Device Technology Inc
Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
- Distributor Offerings: ( 1 listing )
- Number of FFF Equivalents: ( 0 replacements )
- CAD Models: ( Request Part )
- Number of Functional Equivalents: ( 0 options )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
Where used in Applications:
Space Technology
Computing and Data Storage
Financial Technology (Fintech)
Aerospace and Defense
Available Datasheets
| Part # | Manufacturer | Description | Datasheet |
|---|---|---|---|
| 71256SA25PZGI | Renesas Electronics Corporation | 5.0V 32K x 8 Asynchronous Static Ram, TSOP234/Tray | |
| 71256SA25PZGI8 | Renesas Electronics Corporation | 5.0V 32K x 8 Asynchronous Static Ram, TSOP0/Reel | |
| 71256SA25PZG8 | Renesas Electronics Corporation | 5.0V 32K x 8 Asynchronous Static Ram, TSOP0/Reel |
Price & Stock for 71256SA25P by Integrated Device Technology Inc
| Part # | Manufacturer | Description | Stock | Price | Buy | ||
|---|---|---|---|---|---|---|---|
| Bristol Electronics | 7 |
|
RFQ |
CAD Models for 71256SA25P by Integrated Device Technology Inc
Part Data Attributes for 71256SA25P by Integrated Device Technology Inc
|
|
|
|---|---|
|
Rohs Code
|
No
|
|
Part Life Cycle Code
|
Obsolete
|
|
Ihs Manufacturer
|
INTEGRATED DEVICE TECHNOLOGY INC
|
|
Reach Compliance Code
|
not_compliant
|
|
ECCN Code
|
EAR99
|
|
HTS Code
|
8542.32.00.41
|
|
Access Time-Max
|
25 ns
|
|
I/O Type
|
COMMON
|
|
JESD-30 Code
|
R-PDIP-T28
|
|
JESD-609 Code
|
e0
|
|
Memory Density
|
262144 bit
|
|
Memory IC Type
|
STANDARD SRAM
|
|
Memory Width
|
8
|
|
Moisture Sensitivity Level
|
1
|
|
Number of Terminals
|
28
|
|
Number of Words
|
32768 words
|
|
Number of Words Code
|
32000
|
|
Operating Mode
|
ASYNCHRONOUS
|
|
Operating Temperature-Max
|
70 °C
|
|
Operating Temperature-Min
|
|
|
Organization
|
32KX8
|
|
Output Characteristics
|
3-STATE
|
|
Package Body Material
|
PLASTIC/EPOXY
|
|
Package Code
|
DIP
|
|
Package Equivalence Code
|
DIP28,.6
|
|
Package Shape
|
RECTANGULAR
|
|
Package Style
|
IN-LINE
|
|
Parallel/Serial
|
PARALLEL
|
|
Peak Reflow Temperature (Cel)
|
240
|
|
Qualification Status
|
Not Qualified
|
|
Standby Current-Max
|
0.015 A
|
|
Standby Voltage-Min
|
4.5 V
|
|
Supply Current-Max
|
0.145 mA
|
|
Supply Voltage-Nom (Vsup)
|
5 V
|
|
Surface Mount
|
NO
|
|
Technology
|
CMOS
|
|
Temperature Grade
|
COMMERCIAL
|
|
Terminal Finish
|
TIN LEAD
|
|
Terminal Form
|
THROUGH-HOLE
|
|
Terminal Pitch
|
2.54 mm
|
|
Terminal Position
|
DUAL
|
|
Time@Peak Reflow Temperature-Max (s)
|
20
|