Part Details for 71V2558S166BQG8 by Integrated Device Technology Inc
Overview of 71V2558S166BQG8 by Integrated Device Technology Inc
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Applications
Consumer Electronics
Internet of Things (IoT)
Computing and Data Storage
Part Details for 71V2558S166BQG8
71V2558S166BQG8 CAD Models
71V2558S166BQG8 Part Data Attributes
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71V2558S166BQG8
Integrated Device Technology Inc
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Datasheet
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71V2558S166BQG8
Integrated Device Technology Inc
ZBT SRAM, 256KX18, 3.5ns, CMOS, PBGA165
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Rohs Code | Yes | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | INTEGRATED DEVICE TECHNOLOGY INC | |
Reach Compliance Code | compliant | |
ECCN Code | 3A991.B.2.A | |
HTS Code | 8542.32.00.41 | |
Access Time-Max | 3.5 ns | |
Clock Frequency-Max (fCLK) | 166 MHz | |
I/O Type | COMMON | |
JESD-30 Code | R-PBGA-B165 | |
JESD-609 Code | e1 | |
Memory Density | 4718592 bit | |
Memory IC Type | ZBT SRAM | |
Memory Width | 18 | |
Moisture Sensitivity Level | 3 | |
Number of Terminals | 165 | |
Number of Words | 262144 words | |
Number of Words Code | 256000 | |
Operating Mode | SYNCHRONOUS | |
Operating Temperature-Max | 70 °C | |
Operating Temperature-Min | ||
Organization | 256KX18 | |
Output Characteristics | 3-STATE | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA165,11X15,40 | |
Package Shape | RECTANGULAR | |
Package Style | GRID ARRAY | |
Parallel/Serial | PARALLEL | |
Peak Reflow Temperature (Cel) | 260 | |
Qualification Status | Not Qualified | |
Standby Current-Max | 0.04 A | |
Standby Voltage-Min | 3.14 V | |
Supply Current-Max | 0.35 mA | |
Supply Voltage-Nom (Vsup) | 3.3 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | COMMERCIAL | |
Terminal Finish | TIN SILVER COPPER | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Time@Peak Reflow Temperature-Max (s) | 30 |