Part Details for 71V2558SA133BGI8 by Integrated Device Technology Inc
Overview of 71V2558SA133BGI8 by Integrated Device Technology Inc
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Applications
Consumer Electronics
Internet of Things (IoT)
Computing and Data Storage
Part Details for 71V2558SA133BGI8
71V2558SA133BGI8 CAD Models
71V2558SA133BGI8 Part Data Attributes
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71V2558SA133BGI8
Integrated Device Technology Inc
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Datasheet
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71V2558SA133BGI8
Integrated Device Technology Inc
ZBT SRAM, 256KX18, 4.2ns, CMOS, PBGA119
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| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | INTEGRATED DEVICE TECHNOLOGY INC | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | 3A991.B.2.A | |
| HTS Code | 8542.32.00.41 | |
| Access Time-Max | 4.2 ns | |
| Clock Frequency-Max (fCLK) | 133 MHz | |
| I/O Type | COMMON | |
| JESD-30 Code | R-PBGA-B119 | |
| JESD-609 Code | e0 | |
| Memory Density | 4718592 bit | |
| Memory IC Type | ZBT SRAM | |
| Memory Width | 18 | |
| Moisture Sensitivity Level | 3 | |
| Number of Terminals | 119 | |
| Number of Words | 262144 words | |
| Number of Words Code | 256000 | |
| Operating Mode | SYNCHRONOUS | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 256KX18 | |
| Output Characteristics | 3-STATE | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA119,7X17,50 | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY | |
| Parallel/Serial | PARALLEL | |
| Peak Reflow Temperature (Cel) | 225 | |
| Qualification Status | Not Qualified | |
| Standby Current-Max | 0.045 A | |
| Standby Voltage-Min | 3.14 V | |
| Supply Current-Max | 0.31 mA | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 20 |