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Overview of 71WS512NC0BFWAM3 by Spansion
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- Distributor Offerings: ( 0 listings )
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- Number of Functional Equivalents: ( 0 options )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
CAD Models for 71WS512NC0BFWAM3 by Spansion
Part Data Attributes for 71WS512NC0BFWAM3 by Spansion
|
|
---|---|
Part Life Cycle Code
|
Obsolete
|
Ihs Manufacturer
|
SPANSION INC
|
Part Package Code
|
BGA
|
Package Description
|
TFBGA,
|
Pin Count
|
84
|
Reach Compliance Code
|
unknown
|
ECCN Code
|
EAR99
|
HTS Code
|
8542.32.00.71
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JESD-30 Code
|
R-PBGA-B84
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Length
|
11.6 mm
|
Memory Density
|
536870912 bit
|
Memory IC Type
|
MEMORY CIRCUIT
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Memory Width
|
8
|
Number of Functions
|
1
|
Number of Terminals
|
84
|
Number of Words
|
67108864 words
|
Number of Words Code
|
64000000
|
Operating Mode
|
SYNCHRONOUS
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Operating Temperature-Max
|
85 °C
|
Operating Temperature-Min
|
-25 °C
|
Organization
|
64MX8
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Package Body Material
|
PLASTIC/EPOXY
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Package Code
|
TFBGA
|
Package Shape
|
RECTANGULAR
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Package Style
|
GRID ARRAY, THIN PROFILE, FINE PITCH
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Qualification Status
|
Not Qualified
|
Seated Height-Max
|
1.2 mm
|
Supply Voltage-Max (Vsup)
|
1.95 V
|
Supply Voltage-Min (Vsup)
|
1.7 V
|
Supply Voltage-Nom (Vsup)
|
1.8 V
|
Surface Mount
|
YES
|
Technology
|
CMOS
|
Temperature Grade
|
OTHER
|
Terminal Form
|
BALL
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Terminal Pitch
|
0.8 mm
|
Terminal Position
|
BOTTOM
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Width
|
8 mm
|