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3.3V 256K x 18 ZBT Synchronous PipeLined SRAM w/3.3V I/O, CABGA0/Reel
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Part # | Manufacturer | Description | Datasheet |
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71V3558SA133BQG8 | Renesas Electronics Corporation | 3.3V 256K x 18 ZBT Synchronous PipeLined SRAM w/3.3V I/O |
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71V3558SA133BQG8
Renesas Electronics Corporation
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Datasheet
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71V3558SA133BQG8
Renesas Electronics Corporation
3.3V 256K x 18 ZBT Synchronous PipeLined SRAM w/3.3V I/O, CABGA0/Reel
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Pbfree Code | Yes | |
Rohs Code | Yes | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | RENESAS ELECTRONICS CORP | |
Part Package Code | CABGA | |
Pin Count | 165 | |
Manufacturer Package Code | BQG165 | |
Reach Compliance Code | compliant | |
ECCN Code | NLR | |
HTS Code | 8542320041 | |
Samacsys Manufacturer | Renesas Electronics | |
Access Time-Max | 4.2 ns | |
JESD-30 Code | R-PBGA-B165 | |
JESD-609 Code | e1 | |
Length | 15 mm | |
Memory Density | 4718592 bit | |
Memory IC Type | ZBT SRAM | |
Memory Width | 18 | |
Moisture Sensitivity Level | 3 | |
Number of Functions | 1 | |
Number of Terminals | 165 | |
Number of Words | 262144 words | |
Number of Words Code | 256000 | |
Operating Mode | SYNCHRONOUS | |
Operating Temperature-Max | 70 °C | |
Operating Temperature-Min | ||
Organization | 256KX18 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | TBGA | |
Package Shape | RECTANGULAR | |
Package Style | GRID ARRAY, THIN PROFILE | |
Parallel/Serial | PARALLEL | |
Peak Reflow Temperature (Cel) | 260 | |
Seated Height-Max | 1.2 mm | |
Supply Voltage-Max (Vsup) | 3.465 V | |
Supply Voltage-Min (Vsup) | 3.135 V | |
Supply Voltage-Nom (Vsup) | 3.3 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | COMMERCIAL | |
Terminal Finish | TIN SILVER COPPER | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Width | 13 mm |