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Part Details for 71V35761SA200BGG8 by Renesas Electronics Corporation
Overview of 71V35761SA200BGG8 by Renesas Electronics Corporation
- Distributor Offerings: (4 listings)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Available)
- Number of Functional Equivalents: (0 crosses)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Price & Stock for 71V35761SA200BGG8
| Part # | Distributor | Description | Stock | Price | Buy | |
|---|---|---|---|---|---|---|
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DISTI #
71V35761SA200BGG8-ND
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DigiKey | IC SRAM 4.5MBIT PAR 119PBGA Min Qty: 1000 Lead time: 18 Weeks Container: Tape & Reel (TR) | Limited Supply - Call |
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$11.5495 | Buy Now |
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DISTI #
71V35761SA200BGG8
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Avnet Americas | 3.3V 128K x 36 Synchronous PipeLined Burst SRAM w/3.3V I/O - Tape and Reel (Alt: 71V35761SA200BGG8) RoHS: Compliant Min Qty: 1000 Package Multiple: 1000 Lead time: 26 Weeks, 1 Days Container: Reel | 0 |
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$10.9982 / $12.5570 | Buy Now |
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Future Electronics | RoHS: Compliant pbFree: Yes Min Qty: 1000 Package Multiple: 1000 Container: Reel | 0Reel |
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$10.8300 | Buy Now |
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DISTI #
71V35761SA200BGG8
|
Avnet Americas | 3.3V 128K x 36 Synchronous PipeLined Burst SRAM w/3.3V I/O - Tape and Reel (Alt: 71V35761SA200BGG8) RoHS: Compliant Min Qty: 1000 Package Multiple: 1000 Lead time: 26 Weeks, 1 Days Container: Reel | 0 |
|
$10.9982 / $12.5570 | Buy Now |
Part Details for 71V35761SA200BGG8
71V35761SA200BGG8 CAD Models
71V35761SA200BGG8 Part Data Attributes:
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71V35761SA200BGG8
Renesas Electronics Corporation
Buy Now
Datasheet
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Compare Parts:
71V35761SA200BGG8
Renesas Electronics Corporation
3.3V 128K x 36 Synchronous PipeLined Burst SRAM w/3.3V I/O, PBGA0/Reel
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| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | End Of Life | |
| Ihs Manufacturer | RENESAS ELECTRONICS CORP | |
| Part Package Code | PBGA | |
| Pin Count | 119 | |
| Manufacturer Package Code | BGG119 | |
| Reach Compliance Code | compliant | |
| ECCN Code | NLR | |
| HTS Code | 8542320041 | |
| Factory Lead Time | 36 Weeks | |
| Samacsys Manufacturer | Renesas Electronics | |
| Access Time-Max | 3.1 ns | |
| Additional Feature | PIPELINED ARCHITECTURE | |
| Clock Frequency-Max (fCLK) | 200 MHz | |
| I/O Type | COMMON | |
| JESD-30 Code | R-PBGA-B119 | |
| JESD-609 Code | e1 | |
| Length | 22 mm | |
| Memory Density | 4718592 bit | |
| Memory IC Type | CACHE SRAM | |
| Memory Width | 36 | |
| Moisture Sensitivity Level | 3 | |
| Number of Functions | 1 | |
| Number of Terminals | 119 | |
| Number of Words | 131072 words | |
| Number of Words Code | 128000 | |
| Operating Mode | SYNCHRONOUS | |
| Operating Temperature-Max | 70 °C | |
| Operating Temperature-Min | ||
| Organization | 128KX36 | |
| Output Characteristics | 3-STATE | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA119,7X17,50 | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY | |
| Parallel/Serial | PARALLEL | |
| Peak Reflow Temperature (Cel) | 260 | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 2.36 mm | |
| Standby Current-Max | 0.03 A | |
| Standby Voltage-Min | 3.14 V | |
| Supply Current-Max | 0.36 mA | |
| Supply Voltage-Max (Vsup) | 3.465 V | |
| Supply Voltage-Min (Vsup) | 3.135 V | |
| Supply Voltage-Nom (Vsup) | 3.3 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | COMMERCIAL | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Width | 14 mm |