Part Details for 74LVC16827APAG by Integrated Device Technology Inc
Overview of 74LVC16827APAG by Integrated Device Technology Inc
- Distributor Offerings: (2 listings)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (1 option)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Industrial Automation
Renewable Energy
Robotics and Drones
Price & Stock for 74LVC16827APAG
Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
2156-74LVC16827APAG-ND
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DigiKey | IC BUFF NON-INVERT 3.6V 56TSSOP Min Qty: 124 Container: Bulk MARKETPLACE PRODUCT |
2955 In Stock |
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$2.4200 | Buy Now |
|
Rochester Electronics | 74LVC16827 - 3.3V CMOS 20-Bit Buffer With 5 Volt Tolerant I/O ' RoHS: Compliant Status: Obsolete Min Qty: 1 | 2955 |
|
$2.0800 / $2.4500 | Buy Now |
Part Details for 74LVC16827APAG
74LVC16827APAG CAD Models
74LVC16827APAG Part Data Attributes
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74LVC16827APAG
Integrated Device Technology Inc
Buy Now
Datasheet
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Compare Parts:
74LVC16827APAG
Integrated Device Technology Inc
TSSOP-56, Tube
|
Pbfree Code | Yes | |
Rohs Code | Yes | |
Part Life Cycle Code | Transferred | |
Ihs Manufacturer | INTEGRATED DEVICE TECHNOLOGY INC | |
Part Package Code | TSSOP | |
Package Description | TSSOP-56 | |
Pin Count | 56 | |
Manufacturer Package Code | PAG56 | |
Reach Compliance Code | compliant | |
ECCN Code | EAR99 | |
HTS Code | 8542.39.00.01 | |
Date Of Intro | 1998-10-01 | |
Control Type | ENABLE LOW | |
Family | LVC/LCX/Z | |
JESD-30 Code | R-PDSO-G56 | |
JESD-609 Code | e3 | |
Length | 14 mm | |
Load Capacitance (CL) | 50 pF | |
Logic IC Type | BUS DRIVER | |
Max I(ol) | 0.024 A | |
Moisture Sensitivity Level | 1 | |
Number of Bits | 10 | |
Number of Functions | 2 | |
Number of Ports | 2 | |
Number of Terminals | 56 | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -40 °C | |
Output Characteristics | 3-STATE | |
Output Polarity | TRUE | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | TSSOP | |
Package Equivalence Code | TSSOP56,.3,20 | |
Package Shape | RECTANGULAR | |
Package Style | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | |
Packing Method | TUBE | |
Peak Reflow Temperature (Cel) | 260 | |
Prop. Delay@Nom-Sup | 4.1 ns | |
Propagation Delay (tpd) | 4.7 ns | |
Qualification Status | Not Qualified | |
Seated Height-Max | 1.1 mm | |
Supply Voltage-Max (Vsup) | 3.6 V | |
Supply Voltage-Min (Vsup) | 2.7 V | |
Supply Voltage-Nom (Vsup) | 3.3 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | INDUSTRIAL | |
Terminal Finish | TIN | |
Terminal Form | GULL WING | |
Terminal Pitch | 0.5 mm | |
Terminal Position | DUAL | |
Width | 6.1 mm |
Alternate Parts for 74LVC16827APAG
This table gives cross-reference parts and alternative options found for 74LVC16827APAG. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of 74LVC16827APAG, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Description | Manufacturer | Compare |
---|---|---|---|
74LVC16827APAG8 | TSSOP-56, Reel | Integrated Device Technology Inc | 74LVC16827APAG vs 74LVC16827APAG8 |