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74LVC16827APAG
Integrated Device Technology Inc
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$1.8000 | Yes | Yes | Transferred | 3.3 V | 4.7 ns | 4.1 ns | 2 | 10 | YES | TSSOP | 50 pF | 3-STATE | LVC/LCX/Z | BUS DRIVER | CMOS | ENABLE LOW | 24 mA | 2 | TRUE | 3.6 V | 2.7 V | INDUSTRIAL | R-PDSO-G56 | Not Qualified | e3 | 1 | 85 °C | -40 °C | 260 | 56 | PLASTIC/EPOXY | TSSOP56,.3,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | TUBE | TIN | GULL WING | 500 µm | DUAL | 1.1 mm | 6.1 mm | 14 mm | INTEGRATED DEVICE TECHNOLOGY INC | TSSOP | TSSOP-56 | 56 | PAG56 | compliant | EAR99 | 8542.39.00.01 | 1998-10-01 | ||||
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74LVC16827APAG8
Integrated Device Technology Inc
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Check for Price | Yes | Yes | Transferred | 3.3 V | 4.7 ns | 4.1 ns | 2 | 10 | YES | TSSOP | 50 pF | 3-STATE | LVC/LCX/Z | BUS DRIVER | CMOS | ENABLE LOW | 24 mA | 2 | TRUE | 3.6 V | 2.7 V | INDUSTRIAL | R-PDSO-G56 | Not Qualified | e3 | 1 | 85 °C | -40 °C | 260 | 56 | PLASTIC/EPOXY | TSSOP56,.3,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | TR | TIN | GULL WING | 500 µm | DUAL | 1.1 mm | 6.1 mm | 14 mm | INTEGRATED DEVICE TECHNOLOGY INC | TSSOP | TSSOP-56 | 56 | PAG56 | compliant | EAR99 | 8542.39.00.01 | 1998-10-01 | ||||
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IDT74LVC16827APAG
Integrated Device Technology Inc
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Check for Price | Yes | Yes | Transferred | 3.3 V | 4.7 ns | 2 | 10 | YES | TSSOP | 3-STATE | LVC/LCX/Z | BUS DRIVER | CMOS | 2 | TRUE | 3.6 V | 2.7 V | INDUSTRIAL | R-PDSO-G56 | Not Qualified | e3 | 1 | 85 °C | -40 °C | 260 | 40 | 56 | PLASTIC/EPOXY | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | MATTE TIN | GULL WING | 500 µm | DUAL | 1.1 mm | 6.1 mm | 14 mm | INTEGRATED DEVICE TECHNOLOGY INC | TSSOP | TSSOP, | 56 | compliant | EAR99 | 8542.39.00.01 | |||||||||||
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IDT74LVC16827APAG8
Integrated Device Technology Inc
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Check for Price | Yes | Yes | Transferred | 3.3 V | 4.7 ns | 2 | 10 | YES | TSSOP | 3-STATE | LVC/LCX/Z | BUS DRIVER | CMOS | 2 | TRUE | 3.6 V | 2.7 V | INDUSTRIAL | R-PDSO-G56 | Not Qualified | e3 | 1 | 85 °C | -40 °C | 56 | PLASTIC/EPOXY | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | MATTE TIN | GULL WING | 500 µm | DUAL | 1.1 mm | 6.1 mm | 14 mm | INTEGRATED DEVICE TECHNOLOGY INC | TSSOP | TSSOP, | 56 | compliant | EAR99 | 8542.39.00.01 | |||||||||||||
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74LVC16827APAG
Renesas Electronics Corporation
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Check for Price | Yes | Yes | Obsolete | 3.3 V | 4.7 ns | 4.1 ns | 2 | 10 | YES | TSSOP | 50 pF | 3-STATE | LVC/LCX/Z | BUS DRIVER | CMOS | ENABLE LOW | 24 mA | 2 | TRUE | 3.6 V | 2.7 V | INDUSTRIAL | R-PDSO-G56 | Not Qualified | e3 | 1 | 85 °C | -40 °C | 260 | 56 | PLASTIC/EPOXY | TSSOP56,.3,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | TUBE | MATTE TIN | GULL WING | 500 µm | DUAL | 1.1 mm | 6.1 mm | 14 mm | RENESAS ELECTRONICS CORP | TSSOP | 56 | PAG56 | compliant | 8542.39.00.01 | Renesas Electronics | ||||||
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74LVC16827APAG8
Renesas Electronics Corporation
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Check for Price | Yes | Yes | Obsolete | 3.3 V | 4.7 ns | 4.1 ns | 2 | 10 | YES | TSSOP | 50 pF | 3-STATE | LVC/LCX/Z | BUS DRIVER | CMOS | ENABLE LOW | 24 mA | 2 | TRUE | 3.6 V | 2.7 V | INDUSTRIAL | R-PDSO-G56 | Not Qualified | e3 | 1 | 85 °C | -40 °C | 260 | 56 | PLASTIC/EPOXY | TSSOP56,.3,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | TR | MATTE TIN | GULL WING | 500 µm | DUAL | 1.1 mm | 6.1 mm | 14 mm | RENESAS ELECTRONICS CORP | TSSOP | 56 | PAG56 | compliant | 8542.39.00.01 | Renesas Electronics |