Part Details for 74LVC2G74DP-Q100H by NXP Semiconductors
Overview of 74LVC2G74DP-Q100H by NXP Semiconductors
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Applications
Consumer Electronics
Computing and Data Storage
Energy and Power Systems
Part Details for 74LVC2G74DP-Q100H
74LVC2G74DP-Q100H CAD Models
74LVC2G74DP-Q100H Part Data Attributes
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74LVC2G74DP-Q100H
NXP Semiconductors
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Datasheet
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74LVC2G74DP-Q100H
NXP Semiconductors
74LVC2G74-Q100 - Single D-type flip-flop with set and reset; positive edge trigger TSSOP 8-Pin
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Rohs Code | Yes | |
Part Life Cycle Code | Transferred | |
Ihs Manufacturer | NXP SEMICONDUCTORS | |
Part Package Code | TSSOP | |
Package Description | 3 MM, PLASTIC, SOT505-2, TSSOP-8 | |
Pin Count | 8 | |
Manufacturer Package Code | SOT505-2 | |
Reach Compliance Code | compliant | |
Family | LVC/LCX/Z | |
JESD-30 Code | S-PDSO-G8 | |
Length | 3 mm | |
Logic IC Type | D FLIP-FLOP | |
Max Frequency@Nom-Sup | 175000000 Hz | |
Max I(ol) | 0.024 A | |
Number of Bits | 1 | |
Number of Functions | 1 | |
Number of Terminals | 8 | |
Operating Temperature-Max | 125 °C | |
Operating Temperature-Min | -40 °C | |
Output Polarity | COMPLEMENTARY | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | TSSOP | |
Package Equivalence Code | TSSOP8,.16 | |
Package Shape | SQUARE | |
Package Style | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | |
Packing Method | TR | |
Prop. Delay@Nom-Sup | 5.9 ns | |
Propagation Delay (tpd) | 13.4 ns | |
Qualification Status | Not Qualified | |
Screening Level | AEC-Q100 | |
Seated Height-Max | 1.1 mm | |
Supply Voltage-Max (Vsup) | 5.5 V | |
Supply Voltage-Min (Vsup) | 1.65 V | |
Supply Voltage-Nom (Vsup) | 1.8 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | AUTOMOTIVE | |
Terminal Form | GULL WING | |
Terminal Pitch | 0.65 mm | |
Terminal Position | DUAL | |
Trigger Type | POSITIVE EDGE | |
Width | 3 mm | |
fmax-Min | 200 MHz |