Part Details for 8403615LA by LOGIC Devices Inc
Overview of 8403615LA by LOGIC Devices Inc
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Applications
Energy and Power Systems
Medical Imaging
Robotics and Drones
Part Details for 8403615LA
8403615LA CAD Models
8403615LA Part Data Attributes
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8403615LA
LOGIC Devices Inc
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8403615LA
LOGIC Devices Inc
Standard SRAM, 2KX8, 120ns, CMOS, CDIP24, CERAMIC, DIP-24
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| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | LOGIC DEVICES INC | |
| Part Package Code | DIP | |
| Package Description | CERAMIC, DIP-24 | |
| Pin Count | 24 | |
| Reach Compliance Code | unknown | |
| ECCN Code | 3A001.A.2.C | |
| HTS Code | 8542.32.00.41 | |
| Access Time-Max | 120 ns | |
| JESD-30 Code | R-GDIP-T24 | |
| Length | 32.004 mm | |
| Memory Density | 16384 bit | |
| Memory IC Type | STANDARD SRAM | |
| Memory Width | 8 | |
| Number of Functions | 1 | |
| Number of Terminals | 24 | |
| Number of Words | 2048 words | |
| Number of Words Code | 2000 | |
| Operating Mode | ASYNCHRONOUS | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -55 °C | |
| Organization | 2KX8 | |
| Package Body Material | CERAMIC, GLASS-SEALED | |
| Package Code | DIP | |
| Package Shape | RECTANGULAR | |
| Package Style | IN-LINE | |
| Parallel/Serial | PARALLEL | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Screening Level | MIL-STD-883 | |
| Seated Height-Max | 5.08 mm | |
| Supply Voltage-Max (Vsup) | 5.5 V | |
| Supply Voltage-Min (Vsup) | 4.5 V | |
| Supply Voltage-Nom (Vsup) | 5 V | |
| Surface Mount | NO | |
| Technology | CMOS | |
| Temperature Grade | MILITARY | |
| Terminal Form | THROUGH-HOLE | |
| Terminal Pitch | 2.54 mm | |
| Terminal Position | DUAL | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Width | 7.62 mm |