Datasheets
8959836BXC by: Micross Components

Standard SRAM, 128KX8, 35ns, CMOS, CDIP32, 0.600 INCH, CERAMIC, DIP-32

Part Details for 8959836BXC by Micross Components

Overview of 8959836BXC by Micross Components

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Applications Internet of Things (IoT) Environmental Monitoring Financial Technology (Fintech) Smart Cities Transportation and Logistics Agriculture Technology Telecommunications Virtual Reality (VR), Augmented Reality (AR), and Vision Systems Education and Research Consumer Electronics Security and Surveillance Audio and Video Systems Computing and Data Storage Healthcare Electronic Manufacturing Entertainment and Gaming

Part Details for 8959836BXC

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8959836BXC Part Data Attributes

8959836BXC Micross Components
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8959836BXC Micross Components Standard SRAM, 128KX8, 35ns, CMOS, CDIP32, 0.600 INCH, CERAMIC, DIP-32
Part Life Cycle Code Transferred
Ihs Manufacturer AUSTIN SEMICONDUCTOR INC
Part Package Code DIP
Package Description DIP,
Pin Count 32
Reach Compliance Code unknown
ECCN Code 3A001.A.2.C
HTS Code 8542.32.00.41
Access Time-Max 35 ns
JESD-30 Code R-CDIP-T32
JESD-609 Code e4
Length 40.64 mm
Memory Density 1048576 bit
Memory IC Type STANDARD SRAM
Memory Width 8
Number of Functions 1
Number of Ports 1
Number of Terminals 32
Number of Words 131072 words
Number of Words Code 128000
Operating Mode ASYNCHRONOUS
Operating Temperature-Max 125 °C
Operating Temperature-Min -55 °C
Organization 128KX8
Output Characteristics 3-STATE
Output Enable YES
Package Body Material CERAMIC, METAL-SEALED COFIRED
Package Code DIP
Package Shape RECTANGULAR
Package Style IN-LINE
Parallel/Serial PARALLEL
Qualification Status Not Qualified
Seated Height-Max 4.34 mm
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V
Supply Voltage-Nom (Vsup) 5 V
Surface Mount NO
Technology CMOS
Temperature Grade MILITARY
Terminal Finish PALLADIUM GOLD
Terminal Form THROUGH-HOLE
Terminal Pitch 2.54 mm
Terminal Position DUAL
Width 15.24 mm

Alternate Parts for 8959836BXC

This table gives cross-reference parts and alternative options found for 8959836BXC. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of 8959836BXC, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
AS7C1024B-20STI Standard SRAM, 128KX8, 20ns, CMOS, PDSO32, 8 X 13.40 MM, STSOP1-32 Alliance Semiconductor Corporation 8959836BXC vs AS7C1024B-20STI
HM62Y8128DLTSI-12UL 128KX8 STANDARD SRAM, 120ns, PDSO32, 8 X 13.40 MM, PLASTIC, TSOP1-32 Renesas Electronics Corporation 8959836BXC vs HM62Y8128DLTSI-12UL
TC55V2001TR-10L IC 256K X 8 STANDARD SRAM, 100 ns, PDSO32, 8 X 20 MM, 0.50 MM PITCH, REVERSE, PLASTIC, TSOP1-32, Static RAM Toshiba America Electronic Components 8959836BXC vs TC55V2001TR-10L
EDI88128CS25TI Standard SRAM, 128KX8, 25ns, CMOS, CDIP32, 0.400 INCH, SIDE BRAZED, CERAMIC, DIP-32 Microsemi Corporation 8959836BXC vs EDI88128CS25TI
AS7C1025-12TI Standard SRAM, 128KX8, 12ns, CMOS, PDSO32, STSOP2-32 Alliance Semiconductor Corporation 8959836BXC vs AS7C1025-12TI
TC518128AFWL-80 IC 128K X 8 PSEUDO STATIC RAM, 80 ns, PDSO32, 0.525 INCH, PLASTIC, SOP-32, Static RAM Toshiba America Electronic Components 8959836BXC vs TC518128AFWL-80
DPS128M8AG-70I Standard SRAM, 128KX8, 70ns, CMOS, CQCC32, CERAMIC, LCC-32 B&B Electronics Manufacturing Company 8959836BXC vs DPS128M8AG-70I
U62H1708TA55G1 Standard SRAM, 128KX8, 55ns, CMOS, PDSO32, LEAD FREE, TSOP1-32 ZMDI 8959836BXC vs U62H1708TA55G1
AS7C31024B-20STC Standard SRAM, 128KX8, 20ns, CMOS, PDSO32, 8 X 13.40 MM, STSOP1-32 Alliance Semiconductor Corporation 8959836BXC vs AS7C31024B-20STC
PDM41024LA15TSOI Standard SRAM, 128KX8, 15ns, CMOS, PDSO32 Paradigm Technology Inc 8959836BXC vs PDM41024LA15TSOI

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