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Part Details for 89H64H16G2ZCBLGI by Renesas Electronics Corporation
Overview of 89H64H16G2ZCBLGI by Renesas Electronics Corporation
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Part Details for 89H64H16G2ZCBLGI
89H64H16G2ZCBLGI CAD Models
89H64H16G2ZCBLGI Part Data Attributes:
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89H64H16G2ZCBLGI
Renesas Electronics Corporation
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89H64H16G2ZCBLGI
Renesas Electronics Corporation
64-lane, 16-port PCIe Gen2 System Interconnect Switch, FCBGA24/Tray
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| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | RENESAS ELECTRONICS CORP | |
| Part Package Code | FCBGA | |
| Pin Count | 1156 | |
| Manufacturer Package Code | BLG1156 | |
| Reach Compliance Code | compliant | |
| ECCN Code | NLR | |
| HTS Code | 8542390001 | |
| Samacsys Manufacturer | Renesas Electronics | |
| Bus Compatibility | I2C; ISA; PCI; SMBUS; VGA | |
| Clock Frequency-Max | 125 MHz | |
| Data Transfer Rate-Max | 64000 MBps | |
| JESD-30 Code | S-PBGA-B1156 | |
| JESD-609 Code | e1 | |
| Length | 35 mm | |
| Moisture Sensitivity Level | 4 | |
| Number of Terminals | 1156 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA1156,34X34,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Peak Reflow Temperature (Cel) | 245 | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 3.42 mm | |
| Supply Current-Max | 6275 mA | |
| Supply Voltage-Max | 1.1 V | |
| Supply Voltage-Min | 0.9 V | |
| Supply Voltage-Nom | 1 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 35 mm | |
| uPs/uCs/Peripheral ICs Type | BUS CONTROLLER, PCI |