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Part Details for 89HPES12NT3ZBBCG by Renesas Electronics Corporation
Overview of 89HPES12NT3ZBBCG by Renesas Electronics Corporation
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Part Details for 89HPES12NT3ZBBCG
89HPES12NT3ZBBCG CAD Models
89HPES12NT3ZBBCG Part Data Attributes:
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89HPES12NT3ZBBCG
Renesas Electronics Corporation
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89HPES12NT3ZBBCG
Renesas Electronics Corporation
12-lane, 3-port PCIe Inter-Domain Switch, CABGA84/Tray
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| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | RENESAS ELECTRONICS CORP | |
| Part Package Code | CABGA | |
| Package Description | CABGA-324 | |
| Pin Count | 324 | |
| Manufacturer Package Code | BCG324 | |
| Reach Compliance Code | compliant | |
| ECCN Code | NLR | |
| HTS Code | 8542390001 | |
| Samacsys Manufacturer | Renesas Electronics | |
| Address Bus Width | ||
| Bus Compatibility | SMBUS | |
| Clock Frequency-Max | 125 MHz | |
| Data Transfer Rate-Max | 6000 MBps | |
| External Data Bus Width | ||
| JESD-30 Code | S-PBGA-B324 | |
| JESD-609 Code | e1 | |
| Length | 19 mm | |
| Moisture Sensitivity Level | 3 | |
| Number of Terminals | 324 | |
| Operating Temperature-Max | 70 °C | |
| Operating Temperature-Min | ||
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Equivalence Code | BGA324,18X18,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Peak Reflow Temperature (Cel) | 260 | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 1.5 mm | |
| Supply Voltage-Max | 1.1 V | |
| Supply Voltage-Min | 0.9 V | |
| Supply Voltage-Nom | 1 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | COMMERCIAL | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Width | 19 mm | |
| uPs/uCs/Peripheral ICs Type | BUS CONTROLLER, PCI |