Part Details for 8S256-55/BXCJC by Motorola Semiconductor Products
Overview of 8S256-55/BXCJC by Motorola Semiconductor Products
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Part Details for 8S256-55/BXCJC
8S256-55/BXCJC CAD Models
8S256-55/BXCJC Part Data Attributes
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8S256-55/BXCJC
Motorola Semiconductor Products
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8S256-55/BXCJC
Motorola Semiconductor Products
SRAM Module, 256KX8, 55ns, Hybrid, CDIP32
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| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | MOTOROLA INC | |
| Package Description | DIP, DIP32,.6 | |
| Reach Compliance Code | unknown | |
| ECCN Code | 3A001.A.2.C | |
| HTS Code | 8542.32.00.41 | |
| Access Time-Max | 55 ns | |
| I/O Type | COMMON | |
| JESD-30 Code | R-XDIP-T32 | |
| JESD-609 Code | e0 | |
| Memory Density | 2097152 bit | |
| Memory IC Type | SRAM MODULE | |
| Memory Width | 8 | |
| Number of Terminals | 32 | |
| Number of Words | 262144 words | |
| Number of Words Code | 256000 | |
| Operating Mode | ASYNCHRONOUS | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -55 °C | |
| Organization | 256KX8 | |
| Output Characteristics | 3-STATE | |
| Package Body Material | CERAMIC | |
| Package Code | DIP | |
| Package Equivalence Code | DIP32,.6 | |
| Package Shape | RECTANGULAR | |
| Package Style | IN-LINE | |
| Parallel/Serial | PARALLEL | |
| Qualification Status | Not Qualified | |
| Screening Level | 38535Q/M;38534H;883B | |
| Standby Current-Max | 0.035 A | |
| Standby Voltage-Min | 4.5 V | |
| Supply Current-Max | 0.095 mA | |
| Supply Voltage-Nom (Vsup) | 5 V | |
| Surface Mount | NO | |
| Technology | HYBRID | |
| Temperature Grade | MILITARY | |
| Terminal Finish | Tin/Lead (Sn/Pb) | |
| Terminal Form | THROUGH-HOLE | |
| Terminal Pitch | 2.54 mm | |
| Terminal Position | DUAL |