Part Details for 935297137551 by NXP Semiconductors
Overview of 935297137551 by NXP Semiconductors
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Applications
Internet of Things (IoT)
Environmental Monitoring
Financial Technology (Fintech)
Smart Cities
Transportation and Logistics
Agriculture Technology
Telecommunications
Virtual Reality (VR), Augmented Reality (AR), and Vision Systems
Education and Research
Consumer Electronics
Security and Surveillance
Audio and Video Systems
Computing and Data Storage
Healthcare
Entertainment and Gaming
Part Details for 935297137551
935297137551 CAD Models
935297137551 Part Data Attributes
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935297137551
NXP Semiconductors
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935297137551
NXP Semiconductors
32-BIT, FLASH, 204MHz, RISC MICROCONTROLLER, PBGA256, 17 X 17 MM, 1 MM HEIGHT, PLASTIC, SOT740-2, MO-192, LBGA-256
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Part Life Cycle Code | Active | |
Ihs Manufacturer | NXP SEMICONDUCTORS | |
Package Description | 17 X 17 MM, 1 MM HEIGHT, PLASTIC, SOT740-2, MO-192, LBGA-256 | |
Reach Compliance Code | compliant | |
HTS Code | 8542.31.00.01 | |
Has ADC | YES | |
Address Bus Width | 24 | |
Bit Size | 32 | |
Clock Frequency-Max | 25 MHz | |
DAC Channels | YES | |
DMA Channels | YES | |
External Data Bus Width | 32 | |
JESD-30 Code | S-PBGA-B256 | |
Length | 17 mm | |
Number of I/O Lines | 164 | |
Number of Terminals | 256 | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -40 °C | |
PWM Channels | YES | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | LBGA | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY, LOW PROFILE | |
ROM Programmability | FLASH | |
Seated Height-Max | 1.55 mm | |
Speed | 204 MHz | |
Supply Voltage-Max | 3.6 V | |
Supply Voltage-Min | 2.2 V | |
Supply Voltage-Nom | 3.3 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | INDUSTRIAL | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 17 mm | |
uPs/uCs/Peripheral ICs Type | MICROCONTROLLER, RISC |