Part Details for 935299666551 by NXP Semiconductors
Overview of 935299666551 by NXP Semiconductors
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Applications
Consumer Electronics
Education and Research
Internet of Things (IoT)
Environmental Monitoring
Financial Technology (Fintech)
Computing and Data Storage
Healthcare
Agriculture Technology
Virtual Reality (VR), Augmented Reality (AR), and Vision Systems
Electronic Manufacturing
Communication and Networking
Robotics and Drones
Part Details for 935299666551
935299666551 CAD Models
935299666551 Part Data Attributes
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935299666551
NXP Semiconductors
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Datasheet
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935299666551
NXP Semiconductors
32-BIT, FLASH, 204MHz, RISC MICROCONTROLLER, PBGA100, 9 X 9 MM, 0.70 MM HEIGHT, PLASTIC, SOT926-1, TFBGA-100
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| Part Life Cycle Code | Active | |
| Ihs Manufacturer | NXP SEMICONDUCTORS | |
| Package Description | 9 X 9 MM, 0.70 MM HEIGHT, PLASTIC, SOT926-1, TFBGA-100 | |
| Reach Compliance Code | unknown | |
| HTS Code | 8542.31.00.01 | |
| Has ADC | YES | |
| Address Bus Width | 24 | |
| Bit Size | 32 | |
| Clock Frequency-Max | 25 MHz | |
| DAC Channels | YES | |
| DMA Channels | YES | |
| External Data Bus Width | 32 | |
| JESD-30 Code | S-PBGA-B100 | |
| Length | 9 mm | |
| Number of I/O Lines | 49 | |
| Number of Terminals | 100 | |
| Operating Temperature-Max | 105 °C | |
| Operating Temperature-Min | -40 °C | |
| PWM Channels | NO | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | TFBGA | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, THIN PROFILE, FINE PITCH | |
| ROM Programmability | FLASH | |
| Seated Height-Max | 1.2 mm | |
| Speed | 204 MHz | |
| Supply Voltage-Max | 3.6 V | |
| Supply Voltage-Min | 2.2 V | |
| Supply Voltage-Nom | 3.3 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Form | BALL | |
| Terminal Pitch | 0.8 mm | |
| Terminal Position | BOTTOM | |
| Width | 9 mm | |
| uPs/uCs/Peripheral ICs Type | MICROCONTROLLER, RISC |