Part Details for 935316993557 by NXP Semiconductors
Overview of 935316993557 by NXP Semiconductors
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- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 crosses)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Internet of Things (IoT)
Environmental Monitoring
Financial Technology (Fintech)
Smart Cities
Transportation and Logistics
Agriculture Technology
Telecommunications
Virtual Reality (VR), Augmented Reality (AR), and Vision Systems
Automotive
Education and Research
Consumer Electronics
Security and Surveillance
Audio and Video Systems
Computing and Data Storage
Healthcare
Entertainment and Gaming
Part Details for 935316993557
935316993557 CAD Models
935316993557 Part Data Attributes:
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935316993557
NXP Semiconductors
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Datasheet
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935316993557
NXP Semiconductors
Microcontroller
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Part Life Cycle Code | Active | |
Ihs Manufacturer | NXP SEMICONDUCTORS | |
Package Description | , | |
Reach Compliance Code | unknown | |
ECCN Code | 3A991.A.2 | |
HTS Code | 8542.31.00.01 | |
Has ADC | YES | |
Address Bus Width | ||
Bit Size | 8 | |
Boundary Scan | NO | |
Clock Frequency-Max | 20 MHz | |
DAC Channels | NO | |
DMA Channels | NO | |
External Data Bus Width | ||
JESD-30 Code | S-PDSO-N8 | |
JESD-609 Code | e3 | |
Length | 4 mm | |
Moisture Sensitivity Level | 3 | |
Number of I/O Lines | 4 | |
Number of Terminals | 8 | |
On Chip Program ROM Width | 8 | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -40 °C | |
PWM Channels | YES | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | HVSON | |
Package Equivalence Code | SOLCC8,.15,32 | |
Package Shape | SQUARE | |
Package Style | SMALL OUTLINE | |
Peak Reflow Temperature (Cel) | 260 | |
Qualification Status | Not Qualified | |
RAM (bytes) | 256 | |
ROM (words) | 4096 | |
ROM Programmability | FLASH | |
Seated Height-Max | 1 mm | |
Speed | 20 MHz | |
Supply Current-Max | 5 mA | |
Supply Voltage-Max | 3.6 V | |
Supply Voltage-Min | 1.8 V | |
Supply Voltage-Nom | 3 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | INDUSTRIAL | |
Terminal Finish | TIN | |
Terminal Form | NO LEAD | |
Terminal Pitch | 0.8 mm | |
Terminal Position | DUAL | |
Time@Peak Reflow Temperature-Max (s) | 40 | |
Width | 4 mm | |
uPs/uCs/Peripheral ICs Type | MICROCONTROLLER |