Part Details for 935321105557 by NXP Semiconductors
Overview of 935321105557 by NXP Semiconductors
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Applications
Internet of Things (IoT)
Environmental Monitoring
Financial Technology (Fintech)
Smart Cities
Transportation and Logistics
Agriculture Technology
Telecommunications
Virtual Reality (VR), Augmented Reality (AR), and Vision Systems
Automotive
Consumer Electronics
Education and Research
Security and Surveillance
Audio and Video Systems
Computing and Data Storage
Healthcare
Renewable Energy
Entertainment and Gaming
Robotics and Drones
Part Details for 935321105557
935321105557 CAD Models
935321105557 Part Data Attributes
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935321105557
NXP Semiconductors
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Datasheet
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935321105557
NXP Semiconductors
RISC Microcontroller
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| Part Life Cycle Code | Not Recommended | |
| Ihs Manufacturer | NXP SEMICONDUCTORS | |
| Reach Compliance Code | unknown | |
| ECCN Code | 3A991.A.2 | |
| HTS Code | 8542.31.00.01 | |
| Has ADC | NO | |
| Additional Feature | ALSO REQUIRES 5V SUPPLY | |
| Address Bus Width | 24 | |
| Bit Size | 32 | |
| Clock Frequency-Max | 84 MHz | |
| DAC Channels | NO | |
| DMA Channels | NO | |
| External Data Bus Width | 32 | |
| JESD-30 Code | S-PBGA-B388 | |
| JESD-609 Code | e1 | |
| Length | 27 mm | |
| Moisture Sensitivity Level | 3 | |
| Number of I/O Lines | ||
| Number of Terminals | 388 | |
| On Chip Program ROM Width | 8 | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -40 °C | |
| PWM Channels | YES | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA388,26X26,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Peak Reflow Temperature (Cel) | 260 | |
| Qualification Status | Not Qualified | |
| RAM (bytes) | 36864 | |
| ROM (words) | 1048576 | |
| ROM Programmability | FLASH | |
| Seated Height-Max | 2.55 mm | |
| Speed | 56 MHz | |
| Supply Current-Max | 230 mA | |
| Supply Voltage-Max | 2.7 V | |
| Supply Voltage-Min | 2.5 V | |
| Supply Voltage-Nom | 2.6 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | AUTOMOTIVE | |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 40 | |
| Width | 27 mm | |
| uPs/uCs/Peripheral ICs Type | MICROCONTROLLER, RISC |