Part Details for 935325464557 by NXP Semiconductors
Overview of 935325464557 by NXP Semiconductors
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- Part Data Attributes: (Available)
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Applications
Industrial Automation
Renewable Energy
Robotics and Drones
Part Details for 935325464557
935325464557 CAD Models
935325464557 Part Data Attributes:
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935325464557
NXP Semiconductors
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935325464557
NXP Semiconductors
Microcontroller
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Part Life Cycle Code | Active | |
Ihs Manufacturer | NXP SEMICONDUCTORS | |
Package Description | HBGA, | |
Reach Compliance Code | unknown | |
HTS Code | 8542.31.00.01 | |
Has ADC | YES | |
Additional Feature | ALSO REQUIRES 3.3V SUPPLY | |
Address Bus Width | 24 | |
Bit Size | 32 | |
Boundary Scan | NO | |
Clock Frequency-Max | 20 MHz | |
DAC Channels | NO | |
DMA Channels | YES | |
External Data Bus Width | 32 | |
JESD-30 Code | S-PBGA-B416 | |
JESD-609 Code | e0 | |
Length | 27 mm | |
Moisture Sensitivity Level | 3 | |
Number of I/O Lines | 256 | |
Number of Terminals | 416 | |
On Chip Program ROM Width | 8 | |
Operating Temperature-Max | 125 °C | |
Operating Temperature-Min | -40 °C | |
PWM Channels | YES | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA416,26X26,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Peak Reflow Temperature (Cel) | 260 | |
Qualification Status | Not Qualified | |
RAM (bytes) | 131072 | |
ROM (words) | 3145728 | |
ROM Programmability | FLASH | |
Seated Height-Max | 2.55 mm | |
Speed | 144 MHz | |
Supply Current-Max | 820 mA | |
Supply Voltage-Max | 1.65 V | |
Supply Voltage-Min | 1.35 V | |
Supply Voltage-Nom | 1.5 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | AUTOMOTIVE | |
Terminal Finish | Tin/Lead (Sn/Pb) | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Time@Peak Reflow Temperature-Max (s) | 40 | |
Width | 27 mm | |
uPs/uCs/Peripheral ICs Type | MICROCONTROLLER, RISC |