Datasheets
AM21L47-55DC by:

Standard SRAM, 4KX1, 55ns, NMOS, CDIP18, CERAMIC, DIP-18

Part Details for AM21L47-55DC by AMD

Overview of AM21L47-55DC by AMD

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Applications Consumer Electronics Security and Surveillance Environmental Monitoring Internet of Things (IoT) Space Technology Smart Cities Aerospace and Defense Healthcare Agriculture Technology Virtual Reality (VR), Augmented Reality (AR), and Vision Systems Medical Imaging Robotics and Drones

Available Datasheets

Part # Manufacturer Description Datasheet
AM27C512-255DC Rochester Electronics LLC UVPROM,
AM27C512-55DC Rochester Electronics AM27C512 - 512K (64K x 8) CMOS EPROM

Part Details for AM21L47-55DC

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AM21L47-55DC Part Data Attributes

AM21L47-55DC AMD
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AM21L47-55DC AMD Standard SRAM, 4KX1, 55ns, NMOS, CDIP18, CERAMIC, DIP-18
Pbfree Code No
Rohs Code No
Part Life Cycle Code Obsolete
Ihs Manufacturer ADVANCED MICRO DEVICES INC
Part Package Code DIP
Package Description DIP, DIP18,.3
Pin Count 18
Reach Compliance Code unknown
ECCN Code EAR99
HTS Code 8542.32.00.41
Access Time-Max 55 ns
Additional Feature AUTOMATIC POWER-DOWN
I/O Type SEPARATE
JESD-30 Code R-GDIP-T18
JESD-609 Code e0
Length 22.86 mm
Memory Density 4096 bit
Memory IC Type STANDARD SRAM
Memory Width 1
Number of Functions 1
Number of Ports 1
Number of Terminals 18
Number of Words 4096 words
Number of Words Code 4000
Operating Mode ASYNCHRONOUS
Operating Temperature-Max 70 °C
Operating Temperature-Min
Organization 4KX1
Output Characteristics 3-STATE
Output Enable NO
Package Body Material CERAMIC, GLASS-SEALED
Package Code DIP
Package Equivalence Code DIP18,.3
Package Shape RECTANGULAR
Package Style IN-LINE
Parallel/Serial PARALLEL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Qualification Status Not Qualified
Screening Level MIL-STD-883 Class C
Seated Height-Max 5.08 mm
Standby Voltage-Min 4.5 V
Supply Current-Max 0.125 mA
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V
Supply Voltage-Nom (Vsup) 5 V
Surface Mount NO
Technology NMOS
Temperature Grade COMMERCIAL
Terminal Form THROUGH-HOLE
Terminal Pitch 2.54 mm
Terminal Position DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 7.62 mm

Alternate Parts for AM21L47-55DC

This table gives cross-reference parts and alternative options found for AM21L47-55DC. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of AM21L47-55DC, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
M38510/28903BVA Standard SRAM, 4KX1, 55ns, CMOS, 0.25 X 0.9375 INCH, DIP-18 SRI International Sarnoff AM21L47-55DC vs M38510/28903BVA
AM21L47-55PCB Standard SRAM, 4KX1, 55ns, NMOS, PDIP18, PLASTIC, DIP-18 AMD AM21L47-55DC vs AM21L47-55PCB
M38510/28903BVX Standard SRAM, 4KX1, 55ns, CMOS, 0.25 X 0.9375 INCH, DIP-18 Cypress Semiconductor AM21L47-55DC vs M38510/28903BVX
AM2147-55DE Standard SRAM, 4KX1, 55ns, NMOS, CDIP18, HERMETIC SEALED, CERAMIC, DIP-18 AMD AM21L47-55DC vs AM2147-55DE
CY2147-55DC Standard SRAM, 4KX1, 55ns, CMOS, CDIP18, 0.300 INCH, CERDIP-18 Cypress Semiconductor AM21L47-55DC vs CY2147-55DC
AM21L47-55PC Standard SRAM, 4KX1, 55ns, NMOS, PDIP18, PLASTIC, DIP-18 AMD AM21L47-55DC vs AM21L47-55PC
M38510/28903BVA Standard SRAM, 4KX1, 55ns, CMOS, 0.25 X 0.9375 INCH, DIP-18 Cypress Semiconductor AM21L47-55DC vs M38510/28903BVA
CY2147-55DC Standard SRAM, 4KX1, 55ns, CMOS, CDIP18, 0.300 INCH, CERDIP-18 Rochester Electronics LLC AM21L47-55DC vs CY2147-55DC
AM21L47-55DCB Standard SRAM, 4KX1, 55ns, NMOS, CDIP18, CERAMIC, DIP-18 AMD AM21L47-55DC vs AM21L47-55DCB
Part Number Description Manufacturer Compare
CY2147-55PC Standard SRAM, 4KX1, 55ns, CMOS, PDIP18, 0.300 INCH, PLASTIC, DIP-18 Cypress Semiconductor AM21L47-55DC vs CY2147-55PC
M38510/23805BVX Standard SRAM, 4KX1, 55ns, MOS, CDIP18, CERAMIC, DIP-18 Rochester Electronics LLC AM21L47-55DC vs M38510/23805BVX
M38510/23805BVA Standard SRAM, 4KX1, 55ns, MOS, CDIP18, CERAMIC, DIP-18 Intel Corporation AM21L47-55DC vs M38510/23805BVA
AM9147-55PC Standard SRAM, 4KX1, 55ns, MOS, PDIP18, 0.300 INCH, PLASTIC, DIP-18 AMD AM21L47-55DC vs AM9147-55PC
AM2147-55/BVA Standard SRAM, 4KX1, 55ns, NMOS, CDIP18, CERAMIC, DIP-18 AMD AM21L47-55DC vs AM2147-55/BVA
M38510/28903BVA Standard SRAM, 4KX1, 55ns, CMOS, 0.25 X 0.9375 INCH, DIP-18 SRI International Sarnoff AM21L47-55DC vs M38510/28903BVA
QD2147H-3 Standard SRAM, 4KX1, 55ns, NMOS, CDIP18, HERMETIC SEALED, CERAMIC, DIP-18 Intel Corporation AM21L47-55DC vs QD2147H-3
AM21L47-55DCB Standard SRAM, 4KX1, 55ns, NMOS, CDIP18, CERAMIC, DIP-18 AMD AM21L47-55DC vs AM21L47-55DCB
AM2147-55PCB Standard SRAM, 4KX1, 55ns, NMOS, PDIP18, PLASTIC, DIP-18 AMD AM21L47-55DC vs AM2147-55PCB
CY2147-55DC Standard SRAM, 4KX1, 55ns, CMOS, CDIP18, 0.300 INCH, CERDIP-18 Rochester Electronics LLC AM21L47-55DC vs CY2147-55DC

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