Part Details for AM2764A-30LI by AMD
Overview of AM2764A-30LI by AMD
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- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Consumer Electronics
Internet of Things (IoT)
Computing and Data Storage
Part Details for AM2764A-30LI
AM2764A-30LI CAD Models
AM2764A-30LI Part Data Attributes
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AM2764A-30LI
AMD
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Datasheet
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AM2764A-30LI
AMD
UVPROM, 8KX8, 300ns, NMOS, CQCC32, CERAMIC, LCC-32
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Pbfree Code | No | |
Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | ADVANCED MICRO DEVICES INC | |
Part Package Code | QFJ | |
Package Description | QCCN, LCC32,.45X.55 | |
Pin Count | 32 | |
Reach Compliance Code | unknown | |
ECCN Code | EAR99 | |
HTS Code | 8542.32.00.71 | |
Access Time-Max | 300 ns | |
I/O Type | COMMON | |
JESD-30 Code | R-CQCC-N32 | |
JESD-609 Code | e0 | |
Length | 13.97 mm | |
Memory Density | 65536 bit | |
Memory IC Type | OTP ROM | |
Memory Width | 8 | |
Number of Functions | 1 | |
Number of Terminals | 32 | |
Number of Words | 8192 words | |
Number of Words Code | 8000 | |
Operating Mode | ASYNCHRONOUS | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -40 °C | |
Organization | 8KX8 | |
Output Characteristics | 3-STATE | |
Package Body Material | CERAMIC, METAL-SEALED COFIRED | |
Package Code | QCCN | |
Package Equivalence Code | LCC32,.45X.55 | |
Package Shape | RECTANGULAR | |
Package Style | CHIP CARRIER | |
Parallel/Serial | PARALLEL | |
Programming Voltage | 12.5 V | |
Qualification Status | Not Qualified | |
Seated Height-Max | 3.556 mm | |
Supply Current-Max | 0.07 mA | |
Supply Voltage-Max (Vsup) | 5.5 V | |
Supply Voltage-Min (Vsup) | 4.5 V | |
Supply Voltage-Nom (Vsup) | 5 V | |
Surface Mount | YES | |
Technology | NMOS | |
Temperature Grade | INDUSTRIAL | |
Terminal Finish | TIN LEAD | |
Terminal Form | NO LEAD | |
Terminal Pitch | 1.27 mm | |
Terminal Position | QUAD | |
Width | 11.43 mm |