Datasheets
AM2764A-3LE by: AMD

UVPROM, 8KX8, 300ns, NMOS, CQCC32, CERAMIC, LCC-32

Part Details for AM2764A-3LE by AMD

Overview of AM2764A-3LE by AMD

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Applications Consumer Electronics Internet of Things (IoT) Computing and Data Storage

Part Details for AM2764A-3LE

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AM2764A-3LE Part Data Attributes:

AM2764A-3LE AMD
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AM2764A-3LE AMD UVPROM, 8KX8, 300ns, NMOS, CQCC32, CERAMIC, LCC-32
Pbfree Code No
Rohs Code No
Part Life Cycle Code Obsolete
Ihs Manufacturer ADVANCED MICRO DEVICES INC
Part Package Code QFJ
Package Description QCCN, LCC32,.45X.55
Pin Count 32
Reach Compliance Code unknown
ECCN Code EAR99
HTS Code 8542.32.00.71
Access Time-Max 300 ns
I/O Type COMMON
JESD-30 Code R-CQCC-N32
JESD-609 Code e0
Length 13.97 mm
Memory Density 65536 bit
Memory IC Type OTP ROM
Memory Width 8
Number of Functions 1
Number of Terminals 32
Number of Words 8192 words
Number of Words Code 8000
Operating Mode ASYNCHRONOUS
Operating Temperature-Max 125 °C
Operating Temperature-Min -55 °C
Organization 8KX8
Output Characteristics 3-STATE
Package Body Material CERAMIC, METAL-SEALED COFIRED
Package Code QCCN
Package Equivalence Code LCC32,.45X.55
Package Shape RECTANGULAR
Package Style CHIP CARRIER
Parallel/Serial PARALLEL
Programming Voltage 12.5 V
Qualification Status Not Qualified
Seated Height-Max 3.556 mm
Supply Current-Max 0.07 mA
Supply Voltage-Max (Vsup) 5.25 V
Supply Voltage-Min (Vsup) 4.75 V
Supply Voltage-Nom (Vsup) 5 V
Surface Mount YES
Technology NMOS
Temperature Grade MILITARY
Terminal Finish TIN LEAD
Terminal Form NO LEAD
Terminal Pitch 1.27 mm
Terminal Position QUAD
Width 11.43 mm

Alternate Parts for AM2764A-3LE

This table gives cross-reference parts and alternative options found for AM2764A-3LE. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of AM2764A-3LE, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
AM27C64-300LC UVPROM, 8KX8, 300ns, CMOS, CQCC32, WINDOWED, CERAMIC, LCC-32 AMD AM2764A-3LE vs AM27C64-300LC
MBM27C64-30-WZ 8KX8 UVPROM, 300ns, CQCC32, METAL SEALED, CERAMIC, LCC-32 FUJITSU Limited AM2764A-3LE vs MBM27C64-30-WZ
MBM27C6430ZW 8KX8 UVPROM, 300ns, CQCC32, METAL SEALED, CERAMIC, LCC-32 FUJITSU Limited AM2764A-3LE vs MBM27C6430ZW
MBM27C64-30 UVPROM, 8KX8, 300ns, CMOS, CQCC32, METAL SEALED, CERAMIC, LCC-32 FUJITSU Semiconductor Limited AM2764A-3LE vs MBM27C64-30
AM2764A-30LEB UVPROM, 8KX8, 300ns, NMOS, CQCC32, CERAMIC, LCC-32 AMD AM2764A-3LE vs AM2764A-30LEB
AM2764A-30LC UVPROM, 8KX8, 300ns, NMOS, CQCC32, CERAMIC, LCC-32 AMD AM2764A-3LE vs AM2764A-30LC
AM27C64-305LC UVPROM, 8KX8, 300ns, CMOS, CQCC32, WINDOWED, CERAMIC, LCC-32 AMD AM2764A-3LE vs AM27C64-305LC
MBM27C64-30 8KX8 UVPROM, 300ns, CQCC32, METAL SEALED, CERAMIC, LCC-32 FUJITSU Limited AM2764A-3LE vs MBM27C64-30
AM27C64-300LI UVPROM, 8KX8, 300ns, CMOS, CQCC32, WINDOWED, CERAMIC, LCC-32 AMD AM2764A-3LE vs AM27C64-300LI
AM27C64-300LEB UVPROM, 8KX8, 300ns, CMOS, CQCC32, WINDOWED, CERAMIC, LCC-32 AMD AM2764A-3LE vs AM27C64-300LEB
Part Number Description Manufacturer Compare
AM27C64-305DI UVPROM, 8KX8, 300ns, CMOS, CDIP28, WINDOWED, CERAMIC, DIP-28 AMD AM2764A-3LE vs AM27C64-305DI
M27C64A-30F1X 8KX8 UVPROM, 300ns, CDIP28, FRIT SEALED, WINDOWED, CERAMIC, DIP-28 STMicroelectronics AM2764A-3LE vs M27C64A-30F1X
MBM27C64-30-X 8KX8 UVPROM, 300ns, CQCC32, METAL SEALED, CERAMIC, LCC-32 FUJITSU Limited AM2764A-3LE vs MBM27C64-30-X
NMC27C64Q300 8KX8 UVPROM, 300ns, CDIP28, WINDOWED, CERAMIC, DIP-28 Texas Instruments AM2764A-3LE vs NMC27C64Q300
AM27C64-300DIB UVPROM, 8KX8, 300ns, CMOS, CDIP28, WINDOWED, CERAMIC, DIP-28 AMD AM2764A-3LE vs AM27C64-300DIB
QD2764A-3 UVPROM, 8KX8, 300ns, NMOS, CDIP28, HERMETIC SEALED, CERAMIC, DIP-28 Intel Corporation AM2764A-3LE vs QD2764A-3
AM2764A-30DE UVPROM, 8KX8, 300ns, NMOS, CDIP28, HERMETIC SEALED, CERAMIC, DIP-28 AMD AM2764A-3LE vs AM2764A-30DE
AM2764A-30DEB UVPROM, 8KX8, 300ns, NMOS, CDIP28, HERMETIC SEALED, CERAMIC, DIP-28 AMD AM2764A-3LE vs AM2764A-30DEB
AM2764A-30DIB UVPROM, 8KX8, 300ns, NMOS, CDIP28, HERMETIC SEALED, CERAMIC, DIP-28 AMD AM2764A-3LE vs AM2764A-30DIB
AM2764A-3LCB UVPROM, 8KX8, 300ns, NMOS, CQCC32, CERAMIC, LCC-32 AMD AM2764A-3LE vs AM2764A-3LCB

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