There are no models available for this part yet.
Overview of AM27C256-125DCB by AMD
Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
- Distributor Offerings: ( 0 listings )
- Number of FFF Equivalents: ( 10 replacements )
- CAD Models: ( Request Part )
- Number of Functional Equivalents: ( 10 options )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
Where used in Applications:
Computing and Data Storage
Financial Technology (Fintech)
Telecommunications
Available Datasheets
| Part # | Manufacturer | Description | Datasheet |
|---|---|---|---|
| AM27C256-55DM/B | Rochester Electronics | AM27C256 - 256K (32KX8) CMOS EPROM | |
| AM27C256-120PC-G | Rochester Electronics | AM27C256 - 256Kb (32K x 8-Bit) CMOS OTP EPROM | |
| AM27C256-150DI | Rochester Electronics LLC | Replacement for AMD part number AM27C256-150DI. Buy from authorized manufacturer Rochester Electronics. |
CAD Models for AM27C256-125DCB by AMD
Part Data Attributes for AM27C256-125DCB by AMD
|
|
|
|---|---|
|
Part Life Cycle Code
|
Obsolete
|
|
Ihs Manufacturer
|
ADVANCED MICRO DEVICES INC
|
|
Part Package Code
|
DIP
|
|
Package Description
|
WDIP,
|
|
Pin Count
|
28
|
|
Reach Compliance Code
|
unknown
|
|
ECCN Code
|
EAR99
|
|
HTS Code
|
8542.32.00.61
|
|
Access Time-Max
|
120 ns
|
|
JESD-30 Code
|
R-GDIP-T28
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|
Length
|
37.1475 mm
|
|
Memory Density
|
262144 bit
|
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Memory IC Type
|
UVPROM
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|
Memory Width
|
8
|
|
Number of Functions
|
1
|
|
Number of Terminals
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28
|
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Number of Words
|
32768 words
|
|
Number of Words Code
|
32000
|
|
Operating Mode
|
ASYNCHRONOUS
|
|
Operating Temperature-Max
|
70 °C
|
|
Operating Temperature-Min
|
|
|
Organization
|
32KX8
|
|
Output Characteristics
|
3-STATE
|
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Package Body Material
|
CERAMIC, GLASS-SEALED
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|
Package Code
|
WDIP
|
|
Package Shape
|
RECTANGULAR
|
|
Package Style
|
IN-LINE, WINDOW
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|
Parallel/Serial
|
PARALLEL
|
|
Qualification Status
|
Not Qualified
|
|
Seated Height-Max
|
5.588 mm
|
|
Supply Current-Max
|
0.05 mA
|
|
Supply Voltage-Max (Vsup)
|
5.25 V
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|
Supply Voltage-Min (Vsup)
|
4.75 V
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Supply Voltage-Nom (Vsup)
|
5 V
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Surface Mount
|
NO
|
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Technology
|
CMOS
|
|
Temperature Grade
|
COMMERCIAL
|
|
Terminal Form
|
THROUGH-HOLE
|
|
Terminal Pitch
|
2.54 mm
|
|
Terminal Position
|
DUAL
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|
Width
|
15.24 mm
|
Alternate Parts for AM27C256-125DCB
This table gives cross-reference parts and alternative options found for AM27C256-125DCB. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of AM27C256-125DCB, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| CY27C256A-120WC | UVPROM, 32KX8, 120ns, CMOS, CDIP28, 0.600 INCH, HERMETIC SEALED, WINDOWED, CERDIP-28 | Cypress Semiconductor | AM27C256-125DCB vs CY27C256A-120WC |
| AT27HC256R-12DC | UVPROM, 32KX8, 120ns, CMOS, CDIP28, 0.600 INCH, WINDOWED, CERDIP-28 | Atmel Corporation | AM27C256-125DCB vs AT27HC256R-12DC |
| TC57256AD-12 | IC 32K X 8 UVPROM, 120 ns, CDIP28, 0.600 INCH, WINDOWED, CERDIP-28, Programmable ROM | Toshiba America Electronic Components | AM27C256-125DCB vs TC57256AD-12 |
| M27C256B-12F6 | 32KX8 UVPROM, 120ns, CDIP28, 0.280 INCH, LEAD FREE, CERAMIC, WINDOWED, FRIT SEALED, DIP-28 | STMicroelectronics | AM27C256-125DCB vs M27C256B-12F6 |
| FT27C256R-12DC | UVPROM, 32KX8, 12ns, CMOS, CDIP28, 0.600 INCH, CERAMIC, DIP-28 | Force Technologies Ltd | AM27C256-125DCB vs FT27C256R-12DC |
| M27C256B-12F1 | 32KX8 UVPROM, 120ns, CDIP28, 0.280 INCH, LEAD FREE, CERAMIC, WINDOWED, FRIT SEALED, DIP-28 | STMicroelectronics | AM27C256-125DCB vs M27C256B-12F1 |
| M27C256B-12F6E | 32KX8 UVPROM, 120ns, CDIP28, 0.280 INCH, ROHS COMPLIANT, CERAMIC, WINDOWED, FRIT SEALED, DIP-28 | STMicroelectronics | AM27C256-125DCB vs M27C256B-12F6E |
| AS27C256-12JM | UVPROM, 32KX8, 120ns, CMOS, CDIP28, 0.600 INCH, CERAMIC, DIP-28 | Micross Components | AM27C256-125DCB vs AS27C256-12JM |
| AM27C256-120/BXA | UVPROM, 32KX8, 120ns, CMOS, CDIP28, WINDOWED, CERAMIC, DIP-28 | AMD | AM27C256-125DCB vs AM27C256-120/BXA |
| M5M27C256AK-12 | UVPROM, 32KX8, 120ns, CMOS, CDIP28, 0.600 INCH, WINDOWED, GLASS SEALED, CERDIP-28 | Mitsubishi Electric | AM27C256-125DCB vs M5M27C256AK-12 |