Part Details for AM27C256-200DCB by Spansion
Overview of AM27C256-200DCB by Spansion
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (10 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Computing and Data Storage
Financial Technology (Fintech)
Telecommunications
Part Details for AM27C256-200DCB
AM27C256-200DCB CAD Models
AM27C256-200DCB Part Data Attributes:
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AM27C256-200DCB
Spansion
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Datasheet
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AM27C256-200DCB
Spansion
UVPROM, 32KX8, 200ns, CMOS, CDIP28, DIP-28
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| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | SPANSION INC | |
| Part Package Code | DIP | |
| Package Description | DIP, | |
| Pin Count | 28 | |
| Reach Compliance Code | unknown | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.61 | |
| Access Time-Max | 200 ns | |
| JESD-30 Code | R-CDIP-T28 | |
| Length | 37.1475 mm | |
| Memory Density | 262144 bit | |
| Memory IC Type | UVPROM | |
| Memory Width | 8 | |
| Number of Functions | 1 | |
| Number of Terminals | 28 | |
| Number of Words | 32768 words | |
| Number of Words Code | 32000 | |
| Operating Mode | ASYNCHRONOUS | |
| Operating Temperature-Max | 70 °C | |
| Operating Temperature-Min | ||
| Organization | 32KX8 | |
| Package Body Material | CERAMIC, METAL-SEALED COFIRED | |
| Package Code | DIP | |
| Package Shape | RECTANGULAR | |
| Package Style | IN-LINE | |
| Parallel/Serial | PARALLEL | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 5.588 mm | |
| Supply Current-Max | 0.025 mA | |
| Supply Voltage-Max (Vsup) | 5.5 V | |
| Supply Voltage-Min (Vsup) | 4.5 V | |
| Supply Voltage-Nom (Vsup) | 5 V | |
| Surface Mount | NO | |
| Technology | CMOS | |
| Temperature Grade | COMMERCIAL | |
| Terminal Form | THROUGH-HOLE | |
| Terminal Pitch | 2.54 mm | |
| Terminal Position | DUAL | |
| Width | 15.24 mm |
Alternate Parts for AM27C256-200DCB
This table gives cross-reference parts and alternative options found for AM27C256-200DCB. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of AM27C256-200DCB, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| AM27256-2DC | UVPROM, 32KX8, 200ns, NMOS, CDIP28, HERMETIC SEALED, CERAMIC, DIP-28 | AMD | AM27C256-200DCB vs AM27256-2DC |
| NMC27C256BQE200 | IC 32K X 8 UVPROM, 200 ns, CDIP28, WINDOWED, CERAMIC, DIP-28, Programmable ROM | National Semiconductor Corporation | AM27C256-200DCB vs NMC27C256BQE200 |
| AM27C256-200DE | UVPROM, 32KX8, 200ns, CMOS, CDIP28, WINDOWED, CERAMIC, DIP-28 | AMD | AM27C256-200DCB vs AM27C256-200DE |
| NMC27C256Q20 | IC 32K X 8 UVPROM, 200 ns, CDIP28, WINDOWED, CERAMIC, DIP-28, Programmable ROM | Texas Instruments | AM27C256-200DCB vs NMC27C256Q20 |
| AM27C256-200DIB | UVPROM, 32KX8, 200ns, CMOS, CDIP28, DIP-28 | Spansion | AM27C256-200DCB vs AM27C256-200DIB |
| AM27256-2DEB | UVPROM, 32KX8, 200ns, NMOS, CDIP28, HERMETIC SEALED, CERAMIC, DIP-28 | AMD | AM27C256-200DCB vs AM27256-2DEB |
| AD27C256-200V10 | UVPROM, 32KX8, 200ns, CMOS, CDIP28, WINDOWED, CERDIP-28 | Intel Corporation | AM27C256-200DCB vs AD27C256-200V10 |
| AM27C256-205DI | UVPROM, 32KX8, 200ns, CMOS, CDIP28, WINDOWED, CERAMIC, DIP-28 | AMD | AM27C256-200DCB vs AM27C256-205DI |
| NMC27C256BQE200 | 32KX8 UVPROM, 200ns, CDIP28, WINDOWED, CERAMIC, DIP-28 | Texas Instruments | AM27C256-200DCB vs NMC27C256BQE200 |
| TMS27C256-20JE | 262 144-Bitprogrammable Read-Only Memory 28-CDIP -40 to 85 | Texas Instruments | AM27C256-200DCB vs TMS27C256-20JE |