Part Details for AM27C256-255DIB by Spansion
Overview of AM27C256-255DIB by Spansion
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (10 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Computing and Data Storage
Financial Technology (Fintech)
Telecommunications
Part Details for AM27C256-255DIB
AM27C256-255DIB CAD Models
AM27C256-255DIB Part Data Attributes
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AM27C256-255DIB
Spansion
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Datasheet
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AM27C256-255DIB
Spansion
UVPROM, 32KX8, 250ns, CMOS, CDIP28, DIP-28
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Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | SPANSION INC | |
Part Package Code | DIP | |
Package Description | DIP, | |
Pin Count | 28 | |
Reach Compliance Code | unknown | |
ECCN Code | EAR99 | |
HTS Code | 8542.32.00.61 | |
Access Time-Max | 250 ns | |
JESD-30 Code | R-CDIP-T28 | |
Length | 37.1475 mm | |
Memory Density | 262144 bit | |
Memory IC Type | UVPROM | |
Memory Width | 8 | |
Number of Functions | 1 | |
Number of Terminals | 28 | |
Number of Words | 32768 words | |
Number of Words Code | 32000 | |
Operating Mode | ASYNCHRONOUS | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -40 °C | |
Organization | 32KX8 | |
Package Body Material | CERAMIC, METAL-SEALED COFIRED | |
Package Code | DIP | |
Package Shape | RECTANGULAR | |
Package Style | IN-LINE | |
Parallel/Serial | PARALLEL | |
Qualification Status | Not Qualified | |
Seated Height-Max | 5.588 mm | |
Supply Current-Max | 0.025 mA | |
Supply Voltage-Max (Vsup) | 5.25 V | |
Supply Voltage-Min (Vsup) | 4.75 V | |
Supply Voltage-Nom (Vsup) | 5 V | |
Surface Mount | NO | |
Technology | CMOS | |
Temperature Grade | INDUSTRIAL | |
Terminal Form | THROUGH-HOLE | |
Terminal Pitch | 2.54 mm | |
Terminal Position | DUAL | |
Width | 15.24 mm |
Alternate Parts for AM27C256-255DIB
This table gives cross-reference parts and alternative options found for AM27C256-255DIB. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of AM27C256-255DIB, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Description | Manufacturer | Compare |
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AM27C256-255DCB | UVPROM, 32KX8, 250ns, CMOS, CDIP28, DIP-28 | Spansion | AM27C256-255DIB vs AM27C256-255DCB |
M27256F1 | 32KX8 UVPROM, 250ns, CDIP28, WINDOWED, FRIT SEALED, CERAMIC, DIP-28 | STMicroelectronics | AM27C256-255DIB vs M27256F1 |
AM27C256-250DCB | UVPROM, 32KX8, 250ns, CMOS, CDIP28, WINDOWED, CERAMIC, DIP-28 | AMD | AM27C256-255DIB vs AM27C256-250DCB |
NMC27C256Q250 | IC 32K X 8 UVPROM, 250 ns, CDIP28, WINDOWED, CERAMIC, DIP-28, Programmable ROM | National Semiconductor Corporation | AM27C256-255DIB vs NMC27C256Q250 |
AM27C256-250DE | UVPROM, 32KX8, 250ns, CMOS, CDIP28, WINDOWED, CERAMIC, DIP-28 | AMD | AM27C256-255DIB vs AM27C256-250DE |
AM27C256-250DC | UVPROM, 32KX8, 250ns, CMOS, CDIP28, WINDOWED, CERAMIC, DIP-28 | AMD | AM27C256-255DIB vs AM27C256-250DC |
AM27C256-255DI | UVPROM, 32KX8, 250ns, CMOS, CDIP28, WINDOWED, CERAMIC, DIP-28 | AMD | AM27C256-255DIB vs AM27C256-255DI |
NMC27C256QM250 | IC 32K X 8 UVPROM, 250 ns, CDIP28, WINDOWED, CERAMIC, DIP-28, Programmable ROM | National Semiconductor Corporation | AM27C256-255DIB vs NMC27C256QM250 |
TMS27C256JL-2 | 32KX8 UVPROM, 250ns, CDIP28, 0.600 INCH, WINDOWED, CERAMIC, DIP-28 | Texas Instruments | AM27C256-255DIB vs TMS27C256JL-2 |
FT27C256R-25DM/883 | UVPROM, 32KX8, 250ns, CMOS, CDIP28, 0.600 INCH, WINDOWED, CERAMIC, DIP-28 | Force Technologies Ltd | AM27C256-255DIB vs FT27C256R-25DM/883 |