Datasheets
AM27C64-150DCB by:

UVPROM, 8KX8, 150ns, CMOS, CDIP28, WINDOWED, CERAMIC, DIP-28

Part Details for AM27C64-150DCB by Rochester Electronics LLC

Overview of AM27C64-150DCB by Rochester Electronics LLC

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Applications Industrial Automation

Part Details for AM27C64-150DCB

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AM27C64-150DCB Part Data Attributes

AM27C64-150DCB Rochester Electronics LLC
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AM27C64-150DCB Rochester Electronics LLC UVPROM, 8KX8, 150ns, CMOS, CDIP28, WINDOWED, CERAMIC, DIP-28
Part Life Cycle Code Contact Manufacturer
Ihs Manufacturer ROCHESTER ELECTRONICS LLC
Package Description DIP,
Reach Compliance Code unknown
ECCN Code EAR99
HTS Code 8542.32.00.61
Access Time-Max 150 ns
JESD-30 Code R-CDIP-T28
Memory Density 65536 bit
Memory IC Type UVPROM
Memory Width 8
Number of Functions 1
Number of Terminals 28
Number of Words 8192 words
Number of Words Code 8000
Operating Mode ASYNCHRONOUS
Operating Temperature-Max 70 °C
Operating Temperature-Min
Organization 8KX8
Package Body Material CERAMIC, METAL-SEALED COFIRED
Package Code DIP
Package Shape RECTANGULAR
Package Style IN-LINE
Parallel/Serial PARALLEL
Supply Current-Max 0.025 mA
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V
Supply Voltage-Nom (Vsup) 5 V
Surface Mount NO
Technology CMOS
Temperature Grade COMMERCIAL
Terminal Form THROUGH-HOLE
Terminal Position DUAL

Alternate Parts for AM27C64-150DCB

This table gives cross-reference parts and alternative options found for AM27C64-150DCB. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of AM27C64-150DCB, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
AT27LV256R-30JI Memory IC Microchip Technology Inc AM27C64-150DCB vs AT27LV256R-30JI
MX27C1024MC-55 OTP ROM, 64KX16, 55ns, CMOS, PDSO40, 0.450 INCH, PLASTIC, MO-099, SOP-40 Macronix International Co Ltd AM27C64-150DCB vs MX27C1024MC-55
TMS27PC256-100FML 32KX8 OTPROM, 100ns, PQCC32 Texas Instruments AM27C64-150DCB vs TMS27PC256-100FML
M27C405-150B1 512KX8 OTPROM, 150ns, PDIP32, 0.600 INCH, PLASTIC, DIP-32 STMicroelectronics AM27C64-150DCB vs M27C405-150B1
WS57C256F-70T 32KX8 UVPROM, 70ns, CDIP28, 0.300 INCH, CERDIP-28 STMicroelectronics AM27C64-150DCB vs WS57C256F-70T
W27E040T-12 EEPROM, 512KX8, 120ns, Parallel, CMOS, PDSO32, TSOP1-32 Winbond Electronics Corp AM27C64-150DCB vs W27E040T-12
LE28DW3215AT-80 Flash, 2MX16, 80ns, PDSO48, 10 X 14 MM, TSOP1-48 SANYO Electric Co Ltd AM27C64-150DCB vs LE28DW3215AT-80
HY27UF084G2-TPIB Flash, 512MX8, PDSO48, 12 X 20 MM, 1.20 MM HEIGHT, LEAD FREE, PLASTIC, TSOP1-48 SK Hynix Inc AM27C64-150DCB vs HY27UF084G2-TPIB
AM29F002T-55JCB Flash, PQCC32, PLASTIC, LCC-32 Spansion AM27C64-150DCB vs AM29F002T-55JCB
TC58DYG02A5TAI0 IC 128M X 8 FLASH 1.8V PROM, PDSO48, 12 X 20 MM, 050 MM PITCH, PLASTIC, TSOP-48, Programmable ROM Toshiba America Electronic Components AM27C64-150DCB vs TC58DYG02A5TAI0

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