Part Details for AT91SAM9G10-CU-999 by Microchip Technology Inc
Overview of AT91SAM9G10-CU-999 by Microchip Technology Inc
- Distributor Offerings: (3 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Industrial Automation
Smart Cities
Price & Stock for AT91SAM9G10-CU-999
| Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
27W9317
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Newark | Bga, Green, Ind Temp, Mrla 217 Lfbga 15X15X1.4Mm T/R Rohs Compliant: Yes |Microchip AT91SAM9G10-CU-999 RoHS: Compliant Min Qty: 500 Package Multiple: 1 Date Code: 0 Container: Reel | 0 |
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Buy Now | |
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DISTI #
AT91SAM9G10-CU-999
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Microchip Technology Inc | BGA, GREEN, IND TEMP, MRLA, Projected EOL: 2025-12-22 RoHS: Compliant pbFree: Yes |
7000 Alternates Available |
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$7.6700 / $10.6400 | Buy Now |
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NAC | BGA, GREEN, IND TEMP, MRLA - Package: 217 LFBGA 15x15x1.4mm T/R RoHS: Compliant Min Qty: 1 Package Multiple: 500 | 0 |
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RFQ |
Part Details for AT91SAM9G10-CU-999
AT91SAM9G10-CU-999 CAD Models
AT91SAM9G10-CU-999 Part Data Attributes
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AT91SAM9G10-CU-999
Microchip Technology Inc
Buy Now
Datasheet
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AT91SAM9G10-CU-999
Microchip Technology Inc
IC MCU 32BIT 32KB ROM 217BGA
|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | MICROCHIP TECHNOLOGY INC | |
| Package Description | LFBGA, BGA217,17X17,32 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A991.A.2 | |
| HTS Code | 8542.31.00.01 | |
| Samacsys Manufacturer | Microchip | |
| Address Bus Width | 26 | |
| Bit Size | 32 | |
| Boundary Scan | YES | |
| Clock Frequency-Max | 50 MHz | |
| External Data Bus Width | 32 | |
| Format | FIXED POINT | |
| Integrated Cache | YES | |
| JESD-30 Code | S-PBGA-B217 | |
| JESD-609 Code | e1 | |
| Length | 15 mm | |
| Low Power Mode | YES | |
| Moisture Sensitivity Level | 3 | |
| Number of DMA Channels | 19 | |
| Number of External Interrupts | 3 | |
| Number of Serial I/Os | 1 | |
| Number of Terminals | 217 | |
| On Chip Data RAM Width | 8 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LFBGA | |
| Package Equivalence Code | BGA217,17X17,32 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE, FINE PITCH | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| RAM (words) | 16384 | |
| Seated Height-Max | 1.4 mm | |
| Speed | 266 MHz | |
| Supply Voltage-Max | 1.32 V | |
| Supply Voltage-Min | 1.08 V | |
| Supply Voltage-Nom | 1.2 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
| Terminal Form | BALL | |
| Terminal Pitch | 0.8 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Width | 15 mm | |
| uPs/uCs/Peripheral ICs Type | MICROPROCESSOR, RISC |