Datasheets
BR100/03,113 by: NXP Semiconductors

DIAC, 36 V, DIAC, DO-35, HERMETIC SEALED, GLASS PACKAGE-2

Part Details for BR100/03,113 by NXP Semiconductors

Overview of BR100/03,113 by NXP Semiconductors

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Part Details for BR100/03,113

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BR100/03,113 Part Data Attributes

BR100/03,113 NXP Semiconductors
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BR100/03,113 NXP Semiconductors DIAC, 36 V, DIAC, DO-35, HERMETIC SEALED, GLASS PACKAGE-2
Rohs Code Yes
Part Life Cycle Code Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS
Part Package Code DO-35
Package Description HERMETIC SEALED, GLASS PACKAGE-2
Pin Count 2
Reach Compliance Code unknown
ECCN Code EAR99
HTS Code 8541.30.00.80
Breakover Voltage-Max 36 V
Breakover Voltage-Min 28 V
Case Connection ISOLATED
Configuration SINGLE
JEDEC-95 Code DO-35
JESD-30 Code O-LALF-W2
JESD-609 Code e3
Number of Elements 1
Number of Terminals 2
Operating Temperature-Max 100 °C
Package Body Material GLASS
Package Shape ROUND
Package Style LONG FORM
Qualification Status Not Qualified
Repetitive Peak Reverse Voltage 3 V
Surface Mount NO
Terminal Finish MATTE TIN
Terminal Form WIRE
Terminal Position AXIAL
Trigger Device Type DIAC

Alternate Parts for BR100/03,113

This table gives cross-reference parts and alternative options found for BR100/03,113. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of BR100/03,113, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
HT-5761A DIAC, 34V V(BO) Max, DO-35, DO-35, 2 PIN Littelfuse Inc BR100/03,113 vs HT-5761A
HT-5761 DIAC, 36V V(BO) Max, DO-35, DO-35, 2 PIN Littelfuse Inc BR100/03,113 vs HT-5761
DB3RI DIAC, 36V V(BO) Max, DO-35, ROHS COMPLIANT, HERMETIC SEALED, GLASS PACKAGE-2 Taiwan Semiconductor BR100/03,113 vs DB3RI
HT-576193RP DIAC, 36V V(BO) Max, DO-35, DO-35, 2 PIN Teccor BR100/03,113 vs HT-576193RP
DB3 DIAC, 36V V(BO) Max, DO-204AH, ROHS COMPLIANT, HERMETIC SEALED, GLASS, DO-35, 2 PIN Fairchild Semiconductor Corporation BR100/03,113 vs DB3
BTD032 DIAC, 36V V(BO) Max Semitronics Corp BR100/03,113 vs BTD032
BR100/03LLD DIAC, 36 V, DIAC, GLASS PACKAGE-2 NXP Semiconductors BR100/03,113 vs BR100/03LLD
BR100/03/T/R 36V, DIAC, DO-35 NXP Semiconductors BR100/03,113 vs BR100/03/T/R
DB3 DIAC, 36V V(BO) Max, DO-35, DO-35, 2 PIN Continental Device India Ltd BR100/03,113 vs DB3
HT32 DIAC, 37V V(BO) Max, DO-35 Loras Industries Inc BR100/03,113 vs HT32
Part Number Description Manufacturer Compare
DB3RI DIAC, 36V V(BO) Max, DO-35, ROHS COMPLIANT, HERMETIC SEALED, GLASS PACKAGE-2 Taiwan Semiconductor BR100/03,113 vs DB3RI
LLDB3SEL DIAC, 36V V(BO) Max, ROHS COMPLIANT, LL-34, 2 PIN Rectron Semiconductor BR100/03,113 vs LLDB3SEL
DB3 DIAC STMicroelectronics BR100/03,113 vs DB3
TCDB3 DIAC, 36V V(BO) Max, DO-35, ROHS COMPLIANT, HERMETIC SEALED, GLASS PACKAGE-2 Tak Cheong Electronics (Holdings) Co Ltd BR100/03,113 vs TCDB3
HT-32 DIAC, 37V V(BO) Max, DO-35, ROHS COMPLIANT, DO-35, 2 PIN Littelfuse Inc BR100/03,113 vs HT-32
HT-5762 DIAC, 40V V(BO) Max, DO-35, ROHS COMPLIANT PACKAGE-2 Littelfuse Inc BR100/03,113 vs HT-5762
DB3 DIAC, 36V V(BO) Max, DO-35, DO-35, 2 PIN Continental Device India Ltd BR100/03,113 vs DB3
CT-32 DIAC, 36V V(BO) Max, DO-35, DO-35, 2 PIN Central Semiconductor Corp BR100/03,113 vs CT-32
BR100/03LLD DIAC, 36 V, DIAC, GLASS PACKAGE-2 NXP Semiconductors BR100/03,113 vs BR100/03LLD
HT-32A91RP DIAC, 36V V(BO) Max, DO-35, DO-35, 2 PIN Teccor BR100/03,113 vs HT-32A91RP

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