Part Details for BR100/03,113 by NXP Semiconductors
Overview of BR100/03,113 by NXP Semiconductors
- Distributor Offerings:
- Number of FFF Equivalents:
- CAD Models:
- Number of Functional Equivalents:
- Part Data Attributes
- Reference Designs:
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Part Details for BR100/03,113
BR100/03,113 CAD Models
BR100/03,113 Part Data Attributes
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BR100/03,113
NXP Semiconductors
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Datasheet
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BR100/03,113
NXP Semiconductors
DIAC, 36 V, DIAC, DO-35, HERMETIC SEALED, GLASS PACKAGE-2
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Rohs Code | Yes | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | NXP SEMICONDUCTORS | |
Part Package Code | DO-35 | |
Package Description | HERMETIC SEALED, GLASS PACKAGE-2 | |
Pin Count | 2 | |
Reach Compliance Code | unknown | |
ECCN Code | EAR99 | |
HTS Code | 8541.30.00.80 | |
Breakover Voltage-Max | 36 V | |
Breakover Voltage-Min | 28 V | |
Case Connection | ISOLATED | |
Configuration | SINGLE | |
JEDEC-95 Code | DO-35 | |
JESD-30 Code | O-LALF-W2 | |
JESD-609 Code | e3 | |
Number of Elements | 1 | |
Number of Terminals | 2 | |
Operating Temperature-Max | 100 °C | |
Package Body Material | GLASS | |
Package Shape | ROUND | |
Package Style | LONG FORM | |
Qualification Status | Not Qualified | |
Repetitive Peak Reverse Voltage | 3 V | |
Surface Mount | NO | |
Terminal Finish | MATTE TIN | |
Terminal Form | WIRE | |
Terminal Position | AXIAL | |
Trigger Device Type | DIAC |
Alternate Parts for BR100/03,113
This table gives cross-reference parts and alternative options found for BR100/03,113. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of BR100/03,113, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Description | Manufacturer | Compare |
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HT-5761A | DIAC, 34V V(BO) Max, DO-35, DO-35, 2 PIN | Littelfuse Inc | BR100/03,113 vs HT-5761A |
HT-5761 | DIAC, 36V V(BO) Max, DO-35, DO-35, 2 PIN | Littelfuse Inc | BR100/03,113 vs HT-5761 |
DB3RI | DIAC, 36V V(BO) Max, DO-35, ROHS COMPLIANT, HERMETIC SEALED, GLASS PACKAGE-2 | Taiwan Semiconductor | BR100/03,113 vs DB3RI |
HT-576193RP | DIAC, 36V V(BO) Max, DO-35, DO-35, 2 PIN | Teccor | BR100/03,113 vs HT-576193RP |
DB3 | DIAC, 36V V(BO) Max, DO-204AH, ROHS COMPLIANT, HERMETIC SEALED, GLASS, DO-35, 2 PIN | Fairchild Semiconductor Corporation | BR100/03,113 vs DB3 |
BTD032 | DIAC, 36V V(BO) Max | Semitronics Corp | BR100/03,113 vs BTD032 |
BR100/03LLD | DIAC, 36 V, DIAC, GLASS PACKAGE-2 | NXP Semiconductors | BR100/03,113 vs BR100/03LLD |
BR100/03/T/R | 36V, DIAC, DO-35 | NXP Semiconductors | BR100/03,113 vs BR100/03/T/R |
DB3 | DIAC, 36V V(BO) Max, DO-35, DO-35, 2 PIN | Continental Device India Ltd | BR100/03,113 vs DB3 |
HT32 | DIAC, 37V V(BO) Max, DO-35 | Loras Industries Inc | BR100/03,113 vs HT32 |