Part Details for BU2464 by ROHM Semiconductor
Overview of BU2464 by ROHM Semiconductor
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Part Details for BU2464
BU2464 CAD Models
BU2464 Part Data Attributes
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BU2464
ROHM Semiconductor
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Datasheet
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BU2464
ROHM Semiconductor
Microcontroller, 4-Bit, MROM, 1MHz, CMOS, PDIP18, DIP-18
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| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | ROHM CO LTD | |
| Part Package Code | DIP | |
| Package Description | DIP, DIP18,.3 | |
| Pin Count | 18 | |
| Reach Compliance Code | unknown | |
| HTS Code | 8542.31.00.01 | |
| Has ADC | NO | |
| Address Bus Width | ||
| Bit Size | 4 | |
| Clock Frequency-Max | 1 MHz | |
| DAC Channels | NO | |
| DMA Channels | NO | |
| External Data Bus Width | ||
| JESD-30 Code | R-PDIP-T18 | |
| JESD-609 Code | e0 | |
| Length | 22.9 mm | |
| Number of I/O Lines | 13 | |
| Number of Terminals | 18 | |
| On Chip Program ROM Width | 8 | |
| Operating Temperature-Max | 75 °C | |
| Operating Temperature-Min | -25 °C | |
| PWM Channels | NO | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | DIP | |
| Package Equivalence Code | DIP18,.3 | |
| Package Shape | RECTANGULAR | |
| Package Style | IN-LINE | |
| Qualification Status | Not Qualified | |
| RAM (bytes) | 8 | |
| ROM (words) | 640 | |
| ROM Programmability | MROM | |
| Seated Height-Max | 4.25 mm | |
| Speed | 1 MHz | |
| Supply Current-Max | 1 mA | |
| Supply Voltage-Max | 4 V | |
| Supply Voltage-Min | 2 V | |
| Supply Voltage-Nom | 3 V | |
| Surface Mount | NO | |
| Technology | CMOS | |
| Temperature Grade | COMMERCIAL EXTENDED | |
| Terminal Finish | Tin/Lead (Sn/Pb) | |
| Terminal Form | THROUGH-HOLE | |
| Terminal Pitch | 2.54 mm | |
| Terminal Position | DUAL | |
| Width | 7.62 mm | |
| uPs/uCs/Peripheral ICs Type | MICROCONTROLLER |