Part Details for BYV95B by NXP Semiconductors
Overview of BYV95B by NXP Semiconductors
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Part Details for BYV95B
BYV95B CAD Models
BYV95B Part Data Attributes
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BYV95B
NXP Semiconductors
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Datasheet
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BYV95B
NXP Semiconductors
DIODE 0.8 A, 400 V, SILICON, SIGNAL DIODE, HERMETIC SEALED, GLASS PACKAGE-2, Signal Diode
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Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | NXP SEMICONDUCTORS | |
Package Description | HERMETIC SEALED, GLASS PACKAGE-2 | |
Pin Count | 2 | |
Reach Compliance Code | unknown | |
ECCN Code | EAR99 | |
HTS Code | 8541.10.00.80 | |
Additional Feature | LOW LEAKAGE CURRENT | |
Case Connection | ISOLATED | |
Configuration | SINGLE | |
Diode Element Material | SILICON | |
Diode Type | RECTIFIER DIODE | |
Forward Voltage-Max (VF) | 1.35 V | |
JESD-30 Code | E-LALF-W2 | |
Moisture Sensitivity Level | 1 | |
Non-rep Pk Forward Current-Max | 35 A | |
Number of Elements | 1 | |
Number of Phases | 1 | |
Number of Terminals | 2 | |
Operating Temperature-Max | 175 °C | |
Output Current-Max | 0.8 A | |
Package Body Material | GLASS | |
Package Shape | ELLIPTICAL | |
Package Style | LONG FORM | |
Peak Reflow Temperature (Cel) | 225 | |
Qualification Status | Not Qualified | |
Rep Pk Reverse Voltage-Max | 400 V | |
Reverse Recovery Time-Max | 0.25 µs | |
Surface Mount | NO | |
Technology | AVALANCHE | |
Terminal Form | WIRE | |
Terminal Position | AXIAL |