Part Details for CS5536AD by AMD
Results Overview of CS5536AD by AMD
- Distributor Offerings: (1 listing)
- Number of FFF Equivalents: (0 replacements)
- Tariff Estimator: (Available) NEW
- Number of Functional Equivalents: (1 option)
- CAD Models: (Request Part)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
CS5536AD Information
CS5536AD by AMD is an Other uP/uC/Peripheral IC.
Other uPs/uCs/Peripheral ICs are under the broader part category of Microcontrollers and Processors.
Microcontrollers (MCUs) are small, low-power integrated circuits used to control embedded systems. Microcontrollers are primarily used to automate and control devices. Read more about Microcontrollers and Processors on our Microcontrollers and Processors part category page.
Price & Stock for CS5536AD
| Part # | Distributor | Description | Stock | Price | Buy | |
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Sense Electronic Company Limited | BGA | 197 |
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RFQ |
US Tariff Estimator: CS5536AD by AMD
Calculations from this tool are estimations only for imports into the United States. Please refer to the distributor or manufacturer and reference official US government sources and authorities to verify any final purchase costs.
Part Details for CS5536AD
CS5536AD Part Data Attributes
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CS5536AD
AMD
Buy Now
Datasheet
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Compare Parts:
CS5536AD
AMD
Microprocessor Circuit, CMOS, PBGA208, LEAD FREE, PLASTIC, MS-034RAJ-2, BGA-208
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| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Part Package Code | BGA | |
| Pin Count | 208 | |
| Reach Compliance Code | Compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.31.00.01 | |
| Additional Feature | Also Operates At 1.25 V And 1.4 Typ | |
| JESD-30 Code | S-PBGA-B208 | |
| JESD-609 Code | e2 | |
| Length | 23 Mm | |
| Moisture Sensitivity Level | 3 | |
| Number of Terminals | 208 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | ||
| Package Body Material | Plastic/Epoxy | |
| Package Code | BGA | |
| Package Equivalence Code | BGA208,17X17,50 | |
| Package Shape | Square | |
| Package Style | Grid Array | |
| Peak Reflow Temperature (Cel) | 260 | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 2.33 Mm | |
| Supply Voltage-Max | 1.44 V | |
| Supply Voltage-Min | 1.16 V | |
| Supply Voltage-Nom | 1.2 V | |
| Surface Mount | Yes | |
| Technology | Cmos | |
| Temperature Grade | Other | |
| Terminal Finish | Tin Silver | |
| Terminal Form | Ball | |
| Terminal Pitch | 1.27 Mm | |
| Terminal Position | Bottom | |
| Width | 23 Mm | |
| uPs/uCs/Peripheral ICs Type | Microprocessor Circuit |
Alternate Parts for CS5536AD
This table gives cross-reference parts and alternative options found for CS5536AD. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of CS5536AD, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Manufacturer | Composite Price | Description | Compare |
|---|---|---|---|---|
| CS5536AF | AMD | Check for Price | Microprocessor Circuit, CMOS, PBGA208 | CS5536AD vs CS5536AF |
CS5536AD Frequently Asked Questions (FAQ)
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The recommended power-on sequence is to apply VCC first, followed by VDD, and then the clock signal. This ensures proper initialization and prevents damage to the device.
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The analog and digital grounds (AGND and DGND) should be connected together at the device, but kept separate from the system ground to minimize noise and ensure proper operation.
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The maximum capacitive load for the output drivers is 100 pF. Exceeding this limit may cause signal degradation or oscillation.
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A reliable reset circuit can be implemented using a resistor-capacitor (RC) network and a diode to ensure a clean reset signal. The reset signal should be asserted for at least 10 ms to ensure proper device reset.
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High-speed signals should be routed as differential pairs, with matched impedance and length, and kept away from noise sources. A solid ground plane and proper decoupling are also essential for reliable operation.