Datasheets
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CSR8670C-IBBH-R by:
Qualcomm

CMOS, PBGA112

Part Details for CSR8670C-IBBH-R by Qualcomm

Results Overview of CSR8670C-IBBH-R by Qualcomm

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Applications Consumer Electronics Internet of Things (IoT) Smart Cities

CSR8670C-IBBH-R Information

CSR8670C-IBBH-R by Qualcomm is an Other uP/uC/Peripheral IC.
Other uPs/uCs/Peripheral ICs are under the broader part category of Microcontrollers and Processors.

Microcontrollers (MCUs) are small, low-power integrated circuits used to control embedded systems. Microcontrollers are primarily used to automate and control devices. Read more about Microcontrollers and Processors on our Microcontrollers and Processors part category page.

Price & Stock for CSR8670C-IBBH-R

Part # Distributor Description Stock Price Buy
DISTI # CSR8670C-IBBH-RCT-ND
DigiKey IC RF TXRX+MCU BLE 112VFBGA Min Qty: 1 Lead time: 22 Weeks Container: Cut Tape (CT), Digi-Reel®, Tape & Reel (TR) 2537
In Stock
  • 1 $19.4000
  • 10 $16.9050
  • 25 $16.0384
  • 100 $14.8506
  • 250 $14.1398
  • 500 $13.6385
  • 2,000 $11.6095
$11.6095 / $19.4000 Buy Now
DISTI # V36:1790_17635449
Arrow Electronics Bluetooth v4.0 SMART SOC Class I/Class II/Class III 3.7V 112-Pin VFBGA T/R COO: Taiwan RoHS: Compliant Min Qty: 2000 Package Multiple: 2000 Lead time: 22 Weeks Date Code: 2504 Americas - 14000
  • 2,000 $11.5600
$11.5600 Buy Now
DISTI # 89086452
Verical Bluetooth v4.0 SMART SOC Class I/Class II/Class III 3.7V 112-Pin VFBGA T/R RoHS: Compliant Min Qty: 2000 Package Multiple: 2000 Date Code: 2504 Americas - 14000
  • 2,000 $11.5600
$11.5600 Buy Now
DISTI # V36:1790_17635449
Arrow Electronics Bluetooth v4.0 SMART SOC Class I/Class II/Class III 3.7V 112-Pin VFBGA T/R COO: Taiwan RoHS: Compliant Min Qty: 2000 Package Multiple: 2000 Lead time: 22 Weeks Date Code: 2504 Americas - 14000
  • 2,000 $11.5600
$11.5600 Buy Now
DISTI # 89086452
Verical Bluetooth v4.0 SMART SOC Class I/Class II/Class III 3.7V 112-Pin VFBGA T/R COO: Taiwan RoHS: Compliant Min Qty: 2000 Package Multiple: 2000 Date Code: 2504 Americas - 14000
  • 2,000 $11.5600
$11.5600 Buy Now
DISTI # V36:1790_17635449
Arrow Electronics Bluetooth v4.0 SMART SOC Class I/Class II/Class III 3.7V 112-Pin VFBGA T/R COO: Taiwan RoHS: Compliant Min Qty: 2000 Package Multiple: 2000 Lead time: 22 Weeks Date Code: 2504 Americas - 14000
  • 2,000 $11.5600
$11.5600 Buy Now
DISTI # 89086452
Verical Bluetooth v4.0 SMART SOC Class I/Class II/Class III 3.7V 112-Pin VFBGA T/R COO: Taiwan RoHS: Compliant Min Qty: 2000 Package Multiple: 2000 Date Code: 2504 Americas - 14000
  • 2,000 $11.5600
$11.5600 Buy Now
Chip Stock Bluetoothv4.0SMARTSOCClassI/ClassII/ClassIII3.7V112-PinVFBGAT/R 11500
RFQ
MacroQuest Electronics ISO 9001: 2015, ISO 14001:2015, ISO 45001:2018 454
  • 1 $17.1400
  • 10 $15.0000
  • 25 $12.8600
$12.8600 / $17.1400 Buy Now
Win Source Electronics IC RF TXRX+MCU BLUTOOTH 112VFBGA 10000
  • 3 $27.5714
  • 6 $22.6227
  • 8 $21.9157
  • 11 $21.2087
  • 15 $20.5017
  • 19 $18.3809
$18.3809 / $27.5714 Buy Now

US Tariff Estimator: CSR8670C-IBBH-R by Qualcomm

Calculations from this tool are estimations only for imports into the United States. Please refer to the distributor or manufacturer and reference official US government sources and authorities to verify any final purchase costs.

CSR8670C-IBBH-R
Qualcomm
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Part Details for CSR8670C-IBBH-R

CSR8670C-IBBH-R CAD Models

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CSR8670C-IBBH-R Part Data Attributes

CSR8670C-IBBH-R Qualcomm
Buy Now Datasheet
Compare Parts:
CSR8670C-IBBH-R Qualcomm CMOS, PBGA112
Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Not Recommended
Package Description Bga,
Reach Compliance Code Unknown
HTS Code 8542.31.00.01
JESD-30 Code S-PBGA-B112
Number of Terminals 112
Package Body Material Plastic/Epoxy
Package Code BGA
Package Shape Square
Package Style Grid Array
Peak Reflow Temperature (Cel) Not Specified
Surface Mount Yes
Technology Cmos
Terminal Form Ball
Terminal Position Bottom
Time@Peak Reflow Temperature-Max (s) Not Specified
uPs/uCs/Peripheral ICs Type Audio Soc
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CSR8670C-IBBH-R Related Parts

CSR8670C-IBBH-R Frequently Asked Questions (FAQ)

  • Qualcomm provides a recommended PCB layout and thermal management guide for CSR8670C-IBBH-R, which includes guidelines for component placement, thermal vias, and heat sink design. It's essential to follow these guidelines to ensure optimal performance and thermal management.

  • To optimize the CSR8670C-IBBH-R for low power consumption, engineers can use various techniques such as dynamic voltage and frequency scaling, clock gating, and power gating. Additionally, Qualcomm provides power management APIs and guidelines to help optimize power consumption.

  • Qualcomm recommends using a 26 MHz crystal oscillator with a load capacitance of 18 pF to 22 pF for the CSR8670C-IBBH-R. The specific crystal oscillator and load capacitor values may vary depending on the application and design requirements.

  • The CSR8670C-IBBH-R has a built-in audio codec and supports various audio processing algorithms. Qualcomm provides software development kits (SDKs) and audio processing libraries to help engineers implement audio processing and codec integration. Additionally, Qualcomm offers technical support and documentation to assist with audio implementation.

  • The CSR8670C-IBBH-R operates within a temperature range of -40°C to 85°C, and it's essential to ensure that the device is operated within the recommended thermal and operating conditions to ensure reliability and performance.

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