Part Details for CSR8670C-IBBH-R by Qualcomm
Results Overview of CSR8670C-IBBH-R by Qualcomm
- Distributor Offerings: (10 listings)
- Number of FFF Equivalents: (0 replacements)
- Tariff Estimator: (Available) NEW
- Number of Functional Equivalents: (0 options)
- CAD Models: (Request Part)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
CSR8670C-IBBH-R Information
CSR8670C-IBBH-R by Qualcomm is an Other uP/uC/Peripheral IC.
Other uPs/uCs/Peripheral ICs are under the broader part category of Microcontrollers and Processors.
Microcontrollers (MCUs) are small, low-power integrated circuits used to control embedded systems. Microcontrollers are primarily used to automate and control devices. Read more about Microcontrollers and Processors on our Microcontrollers and Processors part category page.
Price & Stock for CSR8670C-IBBH-R
| Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
CSR8670C-IBBH-RCT-ND
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DigiKey | IC RF TXRX+MCU BLE 112VFBGA Min Qty: 1 Lead time: 22 Weeks Container: Cut Tape (CT), Digi-Reel®, Tape & Reel (TR) |
2537 In Stock |
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$11.6095 / $19.4000 | Buy Now |
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DISTI #
V36:1790_17635449
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Arrow Electronics | Bluetooth v4.0 SMART SOC Class I/Class II/Class III 3.7V 112-Pin VFBGA T/R COO: Taiwan RoHS: Compliant Min Qty: 2000 Package Multiple: 2000 Lead time: 22 Weeks Date Code: 2504 | Americas - 14000 |
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$11.5600 | Buy Now |
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DISTI #
89086452
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Verical | Bluetooth v4.0 SMART SOC Class I/Class II/Class III 3.7V 112-Pin VFBGA T/R RoHS: Compliant Min Qty: 2000 Package Multiple: 2000 Date Code: 2504 | Americas - 14000 |
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$11.5600 | Buy Now |
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DISTI #
V36:1790_17635449
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Arrow Electronics | Bluetooth v4.0 SMART SOC Class I/Class II/Class III 3.7V 112-Pin VFBGA T/R COO: Taiwan RoHS: Compliant Min Qty: 2000 Package Multiple: 2000 Lead time: 22 Weeks Date Code: 2504 | Americas - 14000 |
|
$11.5600 | Buy Now |
|
DISTI #
89086452
|
Verical | Bluetooth v4.0 SMART SOC Class I/Class II/Class III 3.7V 112-Pin VFBGA T/R COO: Taiwan RoHS: Compliant Min Qty: 2000 Package Multiple: 2000 Date Code: 2504 | Americas - 14000 |
|
$11.5600 | Buy Now |
|
DISTI #
V36:1790_17635449
|
Arrow Electronics | Bluetooth v4.0 SMART SOC Class I/Class II/Class III 3.7V 112-Pin VFBGA T/R COO: Taiwan RoHS: Compliant Min Qty: 2000 Package Multiple: 2000 Lead time: 22 Weeks Date Code: 2504 | Americas - 14000 |
|
$11.5600 | Buy Now |
|
DISTI #
89086452
|
Verical | Bluetooth v4.0 SMART SOC Class I/Class II/Class III 3.7V 112-Pin VFBGA T/R COO: Taiwan RoHS: Compliant Min Qty: 2000 Package Multiple: 2000 Date Code: 2504 | Americas - 14000 |
|
$11.5600 | Buy Now |
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Chip Stock | Bluetoothv4.0SMARTSOCClassI/ClassII/ClassIII3.7V112-PinVFBGAT/R | 11500 |
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RFQ | |
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MacroQuest Electronics | ISO 9001: 2015, ISO 14001:2015, ISO 45001:2018 | 454 |
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$12.8600 / $17.1400 | Buy Now |
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Win Source Electronics | IC RF TXRX+MCU BLUTOOTH 112VFBGA | 10000 |
|
$18.3809 / $27.5714 | Buy Now |
US Tariff Estimator: CSR8670C-IBBH-R by Qualcomm
Calculations from this tool are estimations only for imports into the United States. Please refer to the distributor or manufacturer and reference official US government sources and authorities to verify any final purchase costs.
Part Details for CSR8670C-IBBH-R
CSR8670C-IBBH-R Part Data Attributes
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CSR8670C-IBBH-R
Qualcomm
Buy Now
Datasheet
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Compare Parts:
CSR8670C-IBBH-R
Qualcomm
CMOS, PBGA112
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| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Not Recommended | |
| Package Description | Bga, | |
| Reach Compliance Code | Unknown | |
| HTS Code | 8542.31.00.01 | |
| JESD-30 Code | S-PBGA-B112 | |
| Number of Terminals | 112 | |
| Package Body Material | Plastic/Epoxy | |
| Package Code | BGA | |
| Package Shape | Square | |
| Package Style | Grid Array | |
| Peak Reflow Temperature (Cel) | Not Specified | |
| Surface Mount | Yes | |
| Technology | Cmos | |
| Terminal Form | Ball | |
| Terminal Position | Bottom | |
| Time@Peak Reflow Temperature-Max (s) | Not Specified | |
| uPs/uCs/Peripheral ICs Type | Audio Soc |
CSR8670C-IBBH-R Frequently Asked Questions (FAQ)
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Qualcomm provides a recommended PCB layout and thermal management guide for CSR8670C-IBBH-R, which includes guidelines for component placement, thermal vias, and heat sink design. It's essential to follow these guidelines to ensure optimal performance and thermal management.
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To optimize the CSR8670C-IBBH-R for low power consumption, engineers can use various techniques such as dynamic voltage and frequency scaling, clock gating, and power gating. Additionally, Qualcomm provides power management APIs and guidelines to help optimize power consumption.
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Qualcomm recommends using a 26 MHz crystal oscillator with a load capacitance of 18 pF to 22 pF for the CSR8670C-IBBH-R. The specific crystal oscillator and load capacitor values may vary depending on the application and design requirements.
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The CSR8670C-IBBH-R has a built-in audio codec and supports various audio processing algorithms. Qualcomm provides software development kits (SDKs) and audio processing libraries to help engineers implement audio processing and codec integration. Additionally, Qualcomm offers technical support and documentation to assist with audio implementation.
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The CSR8670C-IBBH-R operates within a temperature range of -40°C to 85°C, and it's essential to ensure that the device is operated within the recommended thermal and operating conditions to ensure reliability and performance.