Part Details for CY7C1061GN30-10BVJXIT by Infineon Technologies AG
Overview of CY7C1061GN30-10BVJXIT by Infineon Technologies AG
- Distributor Offerings: (4 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Computing and Data Storage
Financial Technology (Fintech)
Price & Stock for CY7C1061GN30-10BVJXIT
Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
448-CY7C1061GN30-10BVJXITTR-ND
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DigiKey | IC SRAM 16MBIT PARALLEL 48VFBGA Min Qty: 2000 Lead time: 10 Weeks Container: Tape & Reel (TR) | Temporarily Out of Stock |
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$25.0676 | Buy Now |
DISTI #
CY7C1061GN30-10BVJ
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Avnet Americas | ASYNC SRAMS - Tape and Reel (Alt: CY7C1061GN30-10BVJ) RoHS: Compliant Min Qty: 2000 Package Multiple: 2000 Lead time: 8 Weeks, 0 Days Container: Reel | 0 |
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RFQ | |
DISTI #
727-CY7C1061GN3010BJ
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Mouser Electronics | SRAM ASYNC SRAMS RoHS: Compliant | 0 |
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$24.3400 | Order Now |
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Future Electronics | RoHS: Compliant pbFree: Yes Min Qty: 2000 Package Multiple: 2000 Lead time: 10 Weeks | 0 |
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$16.5000 | Buy Now |
Part Details for CY7C1061GN30-10BVJXIT
CY7C1061GN30-10BVJXIT CAD Models
CY7C1061GN30-10BVJXIT Part Data Attributes
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CY7C1061GN30-10BVJXIT
Infineon Technologies AG
Buy Now
Datasheet
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CY7C1061GN30-10BVJXIT
Infineon Technologies AG
Standard SRAM, 1MX16, 10ns, CMOS, PBGA48,
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Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Ihs Manufacturer | INFINEON TECHNOLOGIES AG | |
Reach Compliance Code | compliant | |
Factory Lead Time | 8 Weeks | |
Samacsys Manufacturer | Infineon | |
Access Time-Max | 10 ns | |
JESD-30 Code | R-PBGA-B48 | |
JESD-609 Code | e1 | |
Length | 8 mm | |
Memory Density | 16777216 bit | |
Memory IC Type | STANDARD SRAM | |
Memory Width | 16 | |
Moisture Sensitivity Level | 3 | |
Number of Functions | 1 | |
Number of Terminals | 48 | |
Number of Words | 1048576 words | |
Number of Words Code | 1000000 | |
Operating Mode | ASYNCHRONOUS | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -40 °C | |
Organization | 1MX16 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | VFBGA | |
Package Shape | RECTANGULAR | |
Package Style | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | |
Parallel/Serial | PARALLEL | |
Peak Reflow Temperature (Cel) | 260 | |
Seated Height-Max | 1 mm | |
Supply Voltage-Max (Vsup) | 3.6 V | |
Supply Voltage-Min (Vsup) | 2.2 V | |
Supply Voltage-Nom (Vsup) | 3 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | INDUSTRIAL | |
Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
Terminal Form | BALL | |
Terminal Pitch | 0.75 mm | |
Terminal Position | BOTTOM | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Width | 6 mm |