There are no models available for this part yet.
Overview of CY7C1262XV18-366BZXC by Infineon Technologies AG
Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
- Distributor Offerings: ( 5 listings )
- Number of FFF Equivalents: ( 0 replacements )
- CAD Models: ( Request Part )
- Number of Functional Equivalents: ( 0 options )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
Price & Stock for CY7C1262XV18-366BZXC by Infineon Technologies AG
| Part # | Manufacturer | Description | Stock | Price | Buy | ||
|---|---|---|---|---|---|---|---|
|
DISTI #
CY7C1262XV18-366BZXC-ND
|
DigiKey | IC SRAM 36MBIT PAR 165FBGA Min Qty: 680 Lead time: 11 Weeks Container: Tray | Temporarily Out of Stock |
|
$71.3275 | Buy Now | |
|
DISTI #
CY7C1262XV18-366BZ
|
Avnet Americas | SRAM Chip Sync Dual 1.8V 36M-Bit 2M x 18 0.45ns 165-Pin FBGA Tray - Trays (Alt: CY7C1262XV18-366BZ) RoHS: Compliant Min Qty: 5 Package Multiple: 1 Lead time: 4 Weeks, 0 Days Container: Tray | 212 Partner Stock |
|
$65.4100 / $80.7900 | Buy Now | |
|
DISTI #
CY7C1262XV18-366BZ
|
Avnet Americas | SRAM Chip Sync Dual 1.8V 36M-Bit 2M x 18 0.45ns 165-Pin FBGA Tray - Trays (Alt: CY7C1262XV18-366BZ) RoHS: Compliant Min Qty: 680 Package Multiple: 136 Lead time: 11 Weeks, 0 Days Container: Tray | 0 |
|
RFQ | ||
|
DISTI #
727-1262XV18-366BZXC
|
Mouser Electronics | SRAM 36MB (2Mx18) 1.8v 366MHz QDR II SRAM RoHS: Compliant | 0 |
|
$69.2500 | Order Now | |
| Future Electronics | RoHS: Compliant pbFree: Yes Min Qty: 680 Package Multiple: 680 Lead time: 11 Weeks | 0 |
|
$69.2500 | Buy Now |
CAD Models for CY7C1262XV18-366BZXC by Infineon Technologies AG
Part Data Attributes for CY7C1262XV18-366BZXC by Infineon Technologies AG
|
|
|
|---|---|
|
Rohs Code
|
Yes
|
|
Part Life Cycle Code
|
Active
|
|
Ihs Manufacturer
|
INFINEON TECHNOLOGIES AG
|
|
Package Description
|
FBGA-165
|
|
Reach Compliance Code
|
compliant
|
|
Factory Lead Time
|
11 Weeks
|
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Additional Feature
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PIPELINED ARCHITECTURE
|
|
Clock Frequency-Max (fCLK)
|
366 MHz
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I/O Type
|
SEPARATE
|
|
JESD-30 Code
|
R-PBGA-B165
|
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JESD-609 Code
|
e1
|
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Length
|
15 mm
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Memory Density
|
37748736 bit
|
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Memory IC Type
|
QDR SRAM
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Memory Width
|
18
|
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Moisture Sensitivity Level
|
3
|
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Number of Functions
|
1
|
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Number of Ports
|
2
|
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Number of Terminals
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165
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Number of Words
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2097152 words
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Number of Words Code
|
2000000
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Operating Mode
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SYNCHRONOUS
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Operating Temperature-Max
|
70 °C
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Operating Temperature-Min
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|
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Organization
|
2MX18
|
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Output Characteristics
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3-STATE
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Output Enable
|
NO
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Package Body Material
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PLASTIC/EPOXY
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Package Code
|
LBGA
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Package Equivalence Code
|
BGA165,11X15,40
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Package Shape
|
RECTANGULAR
|
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Package Style
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GRID ARRAY, LOW PROFILE
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Parallel/Serial
|
PARALLEL
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Peak Reflow Temperature (Cel)
|
260
|
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Qualification Status
|
Not Qualified
|
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Seated Height-Max
|
1.4 mm
|
|
Standby Current-Max
|
0.97 A
|
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Standby Voltage-Min
|
1.7 V
|
|
Supply Current-Max
|
0.97 mA
|
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Supply Voltage-Max (Vsup)
|
1.9 V
|
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Supply Voltage-Min (Vsup)
|
1.7 V
|
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Supply Voltage-Nom (Vsup)
|
1.8 V
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Surface Mount
|
YES
|
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Technology
|
CMOS
|
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Temperature Grade
|
COMMERCIAL
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Terminal Finish
|
Tin/Silver/Copper (Sn/Ag/Cu)
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Terminal Form
|
BALL
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Terminal Pitch
|
1 mm
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Terminal Position
|
BOTTOM
|
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Time@Peak Reflow Temperature-Max (s)
|
30
|
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Width
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13 mm
|