Datasheets
CY7C1370BV25-200AC by: Cypress Semiconductor

ZBT SRAM, 512KX36, 3ns, CMOS, PQFP100, 14 X 20 MM, 1.40 MM HEIGHT, PLASTIC, TQFP-100

Part Details for CY7C1370BV25-200AC by Cypress Semiconductor

Overview of CY7C1370BV25-200AC by Cypress Semiconductor

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Part Details for CY7C1370BV25-200AC

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CY7C1370BV25-200AC Part Data Attributes:

CY7C1370BV25-200AC Cypress Semiconductor
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CY7C1370BV25-200AC Cypress Semiconductor ZBT SRAM, 512KX36, 3ns, CMOS, PQFP100, 14 X 20 MM, 1.40 MM HEIGHT, PLASTIC, TQFP-100
Rohs Code No
Part Life Cycle Code Obsolete
Ihs Manufacturer CYPRESS SEMICONDUCTOR CORP
Part Package Code QFP
Package Description 14 X 20 MM, 1.40 MM HEIGHT, PLASTIC, TQFP-100
Pin Count 100
Reach Compliance Code not_compliant
ECCN Code 3A991.B.2.A
HTS Code 8542.32.00.41
Access Time-Max 3 ns
Additional Feature PIPELINED ARCHITECTURE
Clock Frequency-Max (fCLK) 200 MHz
I/O Type COMMON
JESD-30 Code R-PQFP-G100
JESD-609 Code e0
Length 20 mm
Memory Density 18874368 bit
Memory IC Type ZBT SRAM
Memory Width 36
Number of Functions 1
Number of Terminals 100
Number of Words 524288 words
Number of Words Code 512000
Operating Mode SYNCHRONOUS
Operating Temperature-Max 70 °C
Operating Temperature-Min
Organization 512KX36
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY
Package Code LQFP
Package Equivalence Code BGA119,7X17,50
Package Shape RECTANGULAR
Package Style FLATPACK, LOW PROFILE
Parallel/Serial PARALLEL
Qualification Status Not Qualified
Seated Height-Max 1.6 mm
Standby Current-Max 0.02 A
Standby Voltage-Min 2.38 V
Supply Current-Max 0.28 mA
Supply Voltage-Max (Vsup) 2.625 V
Supply Voltage-Min (Vsup) 2.375 V
Supply Voltage-Nom (Vsup) 2.5 V
Surface Mount YES
Technology CMOS
Temperature Grade COMMERCIAL
Terminal Finish TIN LEAD
Terminal Form GULL WING
Terminal Pitch 0.65 mm
Terminal Position QUAD
Width 14 mm

Alternate Parts for CY7C1370BV25-200AC

This table gives cross-reference parts and alternative options found for CY7C1370BV25-200AC. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of CY7C1370BV25-200AC, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
GS8161Z36BGT-200I ZBT SRAM, 512KX36, 6.5ns, CMOS, PQFP100, ROHS COMPLIANT, TQFP-100 GSI Technology CY7C1370BV25-200AC vs GS8161Z36BGT-200I
GS8161Z36BGT-200T ZBT SRAM, 512KX36, 6.5ns, CMOS, PQFP100, ROHS COMPLIANT, TQFP-100 GSI Technology CY7C1370BV25-200AC vs GS8161Z36BGT-200T
GS8161Z36BT-200T ZBT SRAM, 512KX36, 6.5ns, CMOS, PQFP100, TQFP-100 GSI Technology CY7C1370BV25-200AC vs GS8161Z36BT-200T
CY7C1370CV25-200AC ZBT SRAM, 512KX36, 3ns, CMOS, PQFP100, 14 X 20 MM, 1.40 MM HEIGHT, PLASTIC, TQFP-100 Cypress Semiconductor CY7C1370BV25-200AC vs CY7C1370CV25-200AC
GS8161Z36BGT-200 ZBT SRAM, 512KX36, 6.5ns, CMOS, PQFP100, ROHS COMPLIANT, TQFP-100 GSI Technology CY7C1370BV25-200AC vs GS8161Z36BGT-200
K7N163645A-QC200 ZBT SRAM, 512KX36, 3.2ns, CMOS, PQFP100, 20 X 14 MM, TQFP-100 Samsung Semiconductor CY7C1370BV25-200AC vs K7N163645A-QC200
K7N163645A-QI20 ZBT SRAM, 512KX36, 3.2ns, CMOS, PQFP100, 20 X 14 MM, TQFP-100 Samsung Semiconductor CY7C1370BV25-200AC vs K7N163645A-QI20
IDT71T75602S200PFI ZBT SRAM, 512KX36, 3.2ns, CMOS, PQFP100, 14 X 20 MM, 1.40 MM HEIGHT, PLASTIC, MO-136DJ, TQFP-100 Integrated Device Technology Inc CY7C1370BV25-200AC vs IDT71T75602S200PFI
IDT71T75602S200PFG ZBT SRAM, 512KX36, 3.2ns, CMOS, PQFP100, 14 X 20 MM, 1.40 MM HEIGHT, PLASTIC, MO-136DJ, TQFP-100 Integrated Device Technology Inc CY7C1370BV25-200AC vs IDT71T75602S200PFG
IDT71T75602S200PF ZBT SRAM, 512KX36, 3.2ns, CMOS, PQFP100, 14 X 20 MM, 1.40 MM HEIGHT, PLASTIC, MO-136DJ, TQFP-100 Integrated Device Technology Inc CY7C1370BV25-200AC vs IDT71T75602S200PF
Part Number Description Manufacturer Compare
IDT71T75602S200PFI ZBT SRAM, 512KX36, 3.2ns, CMOS, PQFP100, 14 X 20 MM, 1.40 MM HEIGHT, PLASTIC, MO-136DJ, TQFP-100 Integrated Device Technology Inc CY7C1370BV25-200AC vs IDT71T75602S200PFI
IDT71T75602S200PF ZBT SRAM, 512KX36, 3.2ns, CMOS, PQFP100, 14 X 20 MM, 1.40 MM HEIGHT, PLASTIC, MO-136DJ, TQFP-100 Integrated Device Technology Inc CY7C1370BV25-200AC vs IDT71T75602S200PF
GS8161Z36BGT-200T ZBT SRAM, 512KX36, 6.5ns, CMOS, PQFP100, ROHS COMPLIANT, TQFP-100 GSI Technology CY7C1370BV25-200AC vs GS8161Z36BGT-200T
IDT71T75602S200PFG ZBT SRAM, 512KX36, 3.2ns, CMOS, PQFP100, 14 X 20 MM, 1.40 MM HEIGHT, PLASTIC, MO-136DJ, TQFP-100 Integrated Device Technology Inc CY7C1370BV25-200AC vs IDT71T75602S200PFG
71T75602S200PFGI ZBT SRAM, 512KX36, 3.2ns, CMOS, PQFP100, 14 X 20 MM, 1.40 MM HEIGHT, GREEN, PLASTIC, MO-136DJ, TQFP-100 Integrated Device Technology Inc CY7C1370BV25-200AC vs 71T75602S200PFGI
IDT71T75602S200PFG8 ZBT SRAM, 512KX36, 3.2ns, CMOS, PQFP100, 14 X 20 MM, 1.40 MM HEIGHT, PLASTIC, MO-136DJ, TQFP-100 Integrated Device Technology Inc CY7C1370BV25-200AC vs IDT71T75602S200PFG8
K7N163645A-QI200 ZBT SRAM, 512KX36, 3.2ns, CMOS, PQFP100, 20 X 14 MM, TQFP-100 Samsung Semiconductor CY7C1370BV25-200AC vs K7N163645A-QI200
71T75602S200PFI ZBT SRAM, 512KX36, 3.2ns, CMOS, PQFP100, 14 X 20 MM, 1.40 MM HEIGHT, PLASTIC, MO-136DJ, TQFP-100 Integrated Device Technology Inc CY7C1370BV25-200AC vs 71T75602S200PFI
K7N163645A-QI20 ZBT SRAM, 512KX36, 3.2ns, CMOS, PQFP100, 20 X 14 MM, TQFP-100 Samsung Semiconductor CY7C1370BV25-200AC vs K7N163645A-QI20
71T75602S200PF8 ZBT SRAM, 512KX36, 3.2ns, CMOS, PQFP100, 14 X 20 MM, 1.40 MM HEIGHT, PLASTIC, MO-136DJ, TQFP-100 Integrated Device Technology Inc CY7C1370BV25-200AC vs 71T75602S200PF8

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