Part Details for CY7C1413KV18-300BZCT by Infineon Technologies AG
Overview of CY7C1413KV18-300BZCT by Infineon Technologies AG
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Applications
Consumer Electronics
Internet of Things (IoT)
Computing and Data Storage
Price & Stock for CY7C1413KV18-300BZCT
| Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
448-CY7C1413KV18-300BZCTTR-ND
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DigiKey | IC SRAM 36MBIT PARALLEL 165FBGA Min Qty: 1000 Lead time: 11 Weeks Container: Tape & Reel (TR) | Limited Supply - Call |
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$41.4318 | Buy Now |
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DISTI #
CY7C1413KV18-300BZCT
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Avnet Americas | SRAM Chip Sync Dual 1.8V 36M-Bit 2M x 18 0.45ns 165-Pin FBGA T/R - Tape and Reel (Alt: CY7C1413KV18-300BZCT) RoHS: Not Compliant Min Qty: 1000 Package Multiple: 1000 Lead time: 11 Weeks, 0 Days Container: Reel | 0 |
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$43.4430 / $53.0970 | Buy Now |
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DISTI #
CY7C1413KV18-300BZCT
|
Avnet Americas | SRAM Chip Sync Dual 1.8V 36M-Bit 2M x 18 0.45ns 165-Pin FBGA T/R - Tape and Reel (Alt: CY7C1413KV18-300BZCT) RoHS: Not Compliant Min Qty: 1000 Package Multiple: 1000 Lead time: 11 Weeks, 0 Days Container: Reel | 0 |
|
$43.4430 / $53.0970 | Buy Now |
|
DISTI #
CY7C1413KV18-300BZCT
|
Avnet Americas | SRAM Chip Sync Dual 1.8V 36M-Bit 2M x 18 0.45ns 165-Pin FBGA T/R - Tape and Reel (Alt: CY7C1413KV18-300BZCT) RoHS: Not Compliant Min Qty: 1000 Package Multiple: 1000 Lead time: 11 Weeks, 0 Days Container: Reel | 0 |
|
$43.4430 / $53.0970 | Buy Now |
Part Details for CY7C1413KV18-300BZCT
CY7C1413KV18-300BZCT CAD Models
CY7C1413KV18-300BZCT Part Data Attributes
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CY7C1413KV18-300BZCT
Infineon Technologies AG
Buy Now
Datasheet
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Compare Parts:
CY7C1413KV18-300BZCT
Infineon Technologies AG
Standard SRAM, 2MX18, 0.45ns, CMOS, PBGA165,
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| Rohs Code | No | |
| Part Life Cycle Code | End Of Life | |
| Ihs Manufacturer | INFINEON TECHNOLOGIES AG | |
| Reach Compliance Code | compliant | |
| Factory Lead Time | 11 Weeks | |
| Access Time-Max | 0.45 ns | |
| Clock Frequency-Max (fCLK) | 300 MHz | |
| I/O Type | SEPARATE | |
| JESD-30 Code | R-PBGA-B165 | |
| JESD-609 Code | e0 | |
| Memory Density | 37748736 bit | |
| Memory IC Type | STANDARD SRAM | |
| Memory Width | 18 | |
| Moisture Sensitivity Level | 3 | |
| Number of Terminals | 165 | |
| Number of Words | 2097152 words | |
| Number of Words Code | 2000000 | |
| Operating Mode | SYNCHRONOUS | |
| Operating Temperature-Max | 70 °C | |
| Operating Temperature-Min | ||
| Organization | 2MX18 | |
| Output Characteristics | 3-STATE | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA165,11X15,40 | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY | |
| Parallel/Serial | PARALLEL | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Qualification Status | Not Qualified | |
| Standby Current-Max | 0.27 A | |
| Standby Voltage-Min | 1.7 V | |
| Supply Current-Max | 0.54 mA | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | COMMERCIAL | |
| Terminal Finish | Tin/Lead (Sn/Pb) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |