There are no models available for this part yet.
Overview of CY7C1529V18-278BZXC by Cypress Semiconductor
Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
- Distributor Offerings: ( 0 listings )
- Number of FFF Equivalents: ( 3 replacements )
- CAD Models: ( Request Part )
- Number of Functional Equivalents: ( 10 options )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
Where used in Applications:
Consumer Electronics
Internet of Things (IoT)
Computing and Data Storage
CAD Models for CY7C1529V18-278BZXC by Cypress Semiconductor
Part Data Attributes for CY7C1529V18-278BZXC by Cypress Semiconductor
|
|
|
|---|---|
|
Pbfree Code
|
Yes
|
|
Rohs Code
|
Yes
|
|
Part Life Cycle Code
|
Obsolete
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|
Ihs Manufacturer
|
CYPRESS SEMICONDUCTOR CORP
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|
Part Package Code
|
BGA
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Package Description
|
LBGA, BGA165,11X15,40
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Pin Count
|
165
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|
Reach Compliance Code
|
compliant
|
|
ECCN Code
|
3A991.B.2.A
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|
HTS Code
|
8542.32.00.41
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Access Time-Max
|
0.45 ns
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Additional Feature
|
PIPELINED ARCHITECTURE
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|
I/O Type
|
SEPARATE
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JESD-30 Code
|
R-PBGA-B165
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JESD-609 Code
|
e1
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Length
|
17 mm
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Memory Density
|
75497472 bit
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Memory IC Type
|
DDR SRAM
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Memory Width
|
9
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Moisture Sensitivity Level
|
3
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Number of Functions
|
1
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Number of Terminals
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165
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Number of Words
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8388608 words
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Number of Words Code
|
8000000
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Operating Mode
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SYNCHRONOUS
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Operating Temperature-Max
|
70 °C
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Operating Temperature-Min
|
|
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Organization
|
8MX9
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Output Characteristics
|
3-STATE
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Package Body Material
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PLASTIC/EPOXY
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Package Code
|
LBGA
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Package Equivalence Code
|
BGA165,11X15,40
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Package Shape
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RECTANGULAR
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Package Style
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GRID ARRAY, LOW PROFILE
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Parallel/Serial
|
PARALLEL
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Peak Reflow Temperature (Cel)
|
260
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Qualification Status
|
Not Qualified
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Seated Height-Max
|
1.4 mm
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Standby Current-Max
|
0.392 A
|
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Standby Voltage-Min
|
1.7 V
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Supply Current-Max
|
0.86 mA
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Supply Voltage-Max (Vsup)
|
1.9 V
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Supply Voltage-Min (Vsup)
|
1.7 V
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Supply Voltage-Nom (Vsup)
|
1.8 V
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Surface Mount
|
YES
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Technology
|
CMOS
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Temperature Grade
|
COMMERCIAL
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Terminal Finish
|
Tin/Silver/Copper (Sn/Ag/Cu)
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Terminal Form
|
BALL
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Terminal Pitch
|
1 mm
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Terminal Position
|
BOTTOM
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Time@Peak Reflow Temperature-Max (s)
|
20
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Width
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15 mm
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Alternate Parts for CY7C1529V18-278BZXC
This table gives cross-reference parts and alternative options found for CY7C1529V18-278BZXC. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of CY7C1529V18-278BZXC, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| CY7C1529V18-278BZC | DDR SRAM, 8MX9, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1.40 MM HEIGHT, MO-216, FBGA-165 | Cypress Semiconductor | CY7C1529V18-278BZXC vs CY7C1529V18-278BZC |
| CY7C1529V18-278BZXI | DDR SRAM, 8MX9, 0.45ns, CMOS, PBGA165, 17 X 15 MM, 1.4 MM HEIGHT, LEAD FREE, MO-216, FBGA-165 | Cypress Semiconductor | CY7C1529V18-278BZXC vs CY7C1529V18-278BZXI |
| CY7C1529V18-278BZI | DDR SRAM, 8MX9, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1.40 MM HEIGHT, MO-216, FBGA-165 | Cypress Semiconductor | CY7C1529V18-278BZXC vs CY7C1529V18-278BZI |